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Parametric results for: NT3H2111W0FHKH under Other uPs/uCs/Peripheral ICs

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SNJ54LVT8986HV
 Texas Instruments 		Check for Price Obsolete YES 3 V MICROPROCESSOR CIRCUIT BICMOS 3.6 V 2.7 V MILITARY S-GQFP-F68 Not Qualified 125 °C -55 °C MIL-PRF-38535 68 CERAMIC, GLASS-SEALED QFF QFL68,.5SQ,25 SQUARE FLATPACK FLAT 635 µm QUAD 3.86 mm 12.51 mm 12.51 mm TEXAS INSTRUMENTS INC QFP QFF, QFL68,.5SQ,25 68 unknown 8542.31.00.01
TS(X)PC2605MG66
 Atmel Corporation 		Check for Price Obsolete YES 3.3 V MICROPROCESSOR CIRCUIT BICMOS 3.465 V 3.135 V MILITARY S-CBGA-B241 Not Qualified 125 °C -55 °C 241 CERAMIC, METAL-SEALED COFIRED BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 3.004 mm 25 mm 25 mm ATMEL CORP BGA BGA, 241 unknown 8542.31.00.01
TSPC2605MG66
 Atmel Corporation 		Check for Price Obsolete YES 3.3 V MICROPROCESSOR CIRCUIT BICMOS 3.465 V 3.135 V MILITARY S-CBGA-B241 Not Qualified 125 °C -55 °C 241 CERAMIC, METAL-SEALED COFIRED BGA SQUARE GRID ARRAY BALL 1.27 mm BOTTOM 3.004 mm 25 mm 25 mm ATMEL CORP BGA BGA, 241 unknown 8542.31.00.01
SN74LVT8986ZGV
 Texas Instruments 		$7.8058 Yes Obsolete YES 3 V MICROPROCESSOR CIRCUIT BICMOS 3.6 V 2.7 V INDUSTRIAL S-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 30 64 PLASTIC/EPOXY LFBGA BGA64,8X8,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 8 mm 8 mm TEXAS INSTRUMENTS INC BGA LFBGA, BGA64,8X8,32 64 compliant 8542.39.00.01 EAR99
MAX7349ATG+T
 Maxim Integrated Products 		Check for Price Yes Yes Transferred YES 3.3 V MICROPROCESSOR CIRCUIT BICMOS MONITORS UP TO 64 KEYS 100 µA 3.6 V 2.4 V AUTOMOTIVE S-XQCC-N24 Not Qualified e3 1 125 °C -40 °C 260 30 24 UNSPECIFIED HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 800 µm 4 mm 4 mm MAXIM INTEGRATED PRODUCTS INC QFN HVQCCN, LCC24,.16SQ,20 24 compliant 8542.31.00.01 EAR99
SN74BCT2424AFN
 Texas Instruments 		Check for Price No No Obsolete YES 5 V MICROPROCESSOR CIRCUIT BICMOS 5.25 V 4.75 V COMMERCIAL S-PQCC-J68 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 68 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER J BEND 1.27 mm QUAD 4.57 mm 24.2316 mm 24.2316 mm TEXAS INSTRUMENTS INC QCCJ, not_compliant 8542.31.00.01
SSI33R3750-CGT
 Silicon Systems Inc 		Check for Price No Obsolete YES 5 V BICMOS 55 mA COMMERCIAL S-PQFP-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY QFP QFP32,.35SQ,32 SQUARE FLATPACK Tin/Lead (Sn/Pb) GULL WING 800 µm QUAD SILICON SYSTEMS INC QFP, QFP32,.35SQ,32 unknown 8542.31.00.01
MAX7347AEE
 Maxim Integrated Products 		Check for Price No No Obsolete YES 3.3 V MICROPROCESSOR CIRCUIT BICMOS 100 µA 3.6 V 2.4 V AUTOMOTIVE R-PDSO-G16 Not Qualified e0 1 125 °C -40 °C 16 PLASTIC/EPOXY SSOP SSOP16,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL 1.75 mm 3.9 mm 4.9 mm MAXIM INTEGRATED PRODUCTS INC SSOP 0.150 INCH, 0.025 INCH PITCH, MO-137AB, QSOP-16 16 not_compliant 8542.31.00.01 EAR99
DP83255VF
 Texas Instruments 		Check for Price No Obsolete YES 5 V BICMOS COMMERCIAL S-PQFP-G132 Not Qualified e0 70 °C 132 PLASTIC/EPOXY BQFP SPQFP132,1.1SQ SQUARE FLATPACK Tin/Lead (Sn/Pb) GULL WING 635 µm QUAD NATIONAL SEMICONDUCTOR CORP BQFP, SPQFP132,1.1SQ unknown 8542.31.00.01
MAX7359EWA+
 Maxim Integrated Products 		$4.8909 Yes Yes Obsolete YES 2.5 V MICROPROCESSOR CIRCUIT BICMOS 60 µA 3.6 V 1.62 V INDUSTRIAL S-PBGA-B25 Not Qualified e2 1 85 °C -40 °C 260 30 25 PLASTIC/EPOXY VFBGA BGA25,5X5,16 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH TIN SILVER COPPER NICKEL BALL 400 µm BOTTOM 690 µm 2.09 mm 2.09 mm MAXIM INTEGRATED PRODUCTS INC BGA VFBGA, BGA25,5X5,16 25 compliant 8542.31.00.01 EAR99
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