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MAX14866UTM+
 Analog Devices Inc 		Check for Price Yes Active 1.8 V YES 13 Ω 210 mΩ 4 µs 4 µs SPST DIMOS 1 1 75 dB 5.5 V 1.7 V OTHER S-PQFP-G48 e3 1 85 °C 260 30 48 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH Matte Tin (Sn) GULL WING 500 µm QUAD 5.6 mm 5.6 mm 48-LFCSP-7X7X0.75 48 48-LFCSP-7X7X0.75 2017-11-07 Analog Devices
MAX4516ESA-T
 Maxim Integrated Products 		Check for Price No No Obsolete 5 V YES -5 V 20 Ω 100 ns 75 ns SPST CMOS NO 1 1 86 dB 200 µA 6 V 1 V BREAK-BEFORE-MAKE INDUSTRIAL R-PDSO-G8 Not Qualified e0 1 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE TIN LEAD GULL WING 1.27 mm DUAL 4.9 mm 1.75 mm 3.9 mm SOIC 8 MAXIM INTEGRATED PRODUCTS INC 0.150 INCH, SOIC-8 not_compliant 8542.39.00.01
74HCT4316D,112
 NXP Semiconductors 		Check for Price Yes Transferred 4.5 V YES 320 Ω 16 Ω 50 ns 44 ns SPST CMOS -5 V -1 V NO 1 4 50 dB SEPARATE OUTPUT 5 V 1 V BREAK-BEFORE-MAKE AUTOMOTIVE R-PDSO-G16 Not Qualified e4 1 125 °C -40 °C 260 30 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL SOP 16 SOT109-1 NXP SEMICONDUCTORS PLASTIC, SO-16 compliant 8542.39.00.01
ISL43145IV
 Renesas Electronics Corporation 		Check for Price No Yes Obsolete 5 V YES -5 V 25 Ω 500 mΩ 75 ns 55 ns SPST CMOS -6 V -2 V NO/NC 1 4 71 dB 1 µA 6 V 2 V BREAK-BEFORE-MAKE R-PDSO-G16 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 16 PLASTIC/EPOXY TSSOP TSSOP16,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 650 µm DUAL 5 mm 1.2 mm 4.4 mm TSSOP 16 M16.173 Renesas Electronics RENESAS ELECTRONICS CORP unknown 8542.39.00.01 EAR99
5962R9581301VXX
 Harris Semiconductor 		Check for Price Obsolete 15 V YES -15 V 75 Ω 500 ns 450 ns SPDT CMOS 1 1 MILITARY R-CDFP-F14 Not Qualified 125 °C -55 °C 100k Rad(Si) V 14 CERAMIC, METAL-SEALED COFIRED DFP RECTANGULAR FLATPACK FLAT DUAL HARRIS SEMICONDUCTOR DFP, unknown 8542.39.00.01
MAX4656ESA+
 Maxim Integrated Products 		$3.3499 Yes Yes Transferred 15 V YES -15 V 10 Ω 200 ns 100 ns SPST CMOS -20 V -4.5 V NO 1 1 77 dB 20 V 4.5 V BREAK-BEFORE-MAKE INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE MATTE TIN GULL WING 1.27 mm DUAL 4.9 mm 1.75 mm 3.9 mm SOIC 8 MAXIM INTEGRATED PRODUCTS INC 0.150 INCH, ROHS COMPLIANT, MS-012-AA, SOIC-8 compliant 8542.39.00.01 EAR99
MAX4597DCKRE4
 Texas Instruments 		Check for Price Yes Yes Obsolete 3 V YES 20 Ω 45 ns 50 ns SPST CMOS NC 1 1 83 dB 5.5 V 2 V MAKE-BEFORE-BREAK INDUSTRIAL R-PDSO-G5 Not Qualified e4 1 85 °C -40 °C 260 30 5 PLASTIC/EPOXY TSSOP TSSOP5/6,.08 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH NICKEL PALLADIUM GOLD GULL WING 650 µm DUAL 2 mm 1.1 mm 1.25 mm SOIC 5 TEXAS INSTRUMENTS INC TSSOP, TSSOP5/6,.08 unknown 8542.39.00.01
NX5L2750CGU,115
 NXP Semiconductors 		Check for Price Active 3.3 V YES 1.3 Ω 100 mΩ 160 ns 50 ns SPDT CMOS 1 1 60 dB 5 V 1.8 V INDUSTRIAL R-PQCC-N10 85 °C -40 °C 10 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE NO LEAD 400 µm QUAD 1.8 mm 500 µm 1.4 mm NXP SEMICONDUCTORS XQFN-10 unknown 8542.39.00.01
MC74HC4016N
 onsemi 		Check for Price No Obsolete 4.5 V NO 480 Ω 40 Ω 185 ns 225 ns SPST CMOS NO 1 4 40 dB SEPARATE OUTPUT 12 V 2 V BREAK-BEFORE-MAKE MILITARY R-PDIP-T14 Not Qualified e0 125 °C -55 °C 14 PLASTIC/EPOXY DIP DIP14,.3 RECTANGULAR IN-LINE TIN LEAD THROUGH-HOLE 2.54 mm DUAL 18.86 mm 4.69 mm 7.62 mm DIP 14 ON SEMICONDUCTOR DIP, DIP14,.3 not_compliant 8542.39.00.01
HEF4066BT,653
 NXP Semiconductors 		Check for Price Yes Transferred 15 V YES 175 Ω 5 Ω 30 ns 140 ns SPST CMOS NO 1 4 50 dB SEPARATE OUTPUT INDUSTRIAL R-PDSO-G14 Not Qualified e4 1 85 °C -40 °C 260 30 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 1.27 mm DUAL 8.65 mm 1.75 mm 3.9 mm SOIC 14 SOT108-1 NXP NXP SEMICONDUCTORS PLASTIC, SO-14 compliant 8542.39.00.01
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