Filter Your Search
1 - 10 of 50,985 results
|
IH5014MJD/B
General Electric Solid State
|
Check for Price | No | Obsolete | NO | 385 Ω | 500 ns | SPST | NC | 3 | COMMON OUTPUT | MAKE-BEFORE-BREAK | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GENERAL ELECTRIC SOLID STATE | DIP, DIP14,.3 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||
|
MAX14866UTM+
Analog Devices Inc
|
Check for Price | Yes | Active | 1.8 V | YES | 13 Ω | 210 mΩ | 4 µs | 4 µs | SPST | DIMOS | 1 | 1 | 75 dB | 5.5 V | 1.7 V | OTHER | S-PQFP-G48 | e3 | 1 | 85 °C | 260 | 30 | 48 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 5.6 mm | 5.6 mm | 48-LFCSP-7X7X0.75 | 48 | 48-LFCSP-7X7X0.75 | 2017-11-07 | Analog Devices | ||||||||||||||||||||||||
|
DG153ADD/883B
General Electric Solid State
|
Check for Price | No | Obsolete | NO | 500 ns | DPST | NO | 2 | SEPARATE OUTPUT | MAKE-BEFORE-BREAK | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GENERAL ELECTRIC SOLID STATE | DIP, DIP14,.3 | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||||||||
|
MAX4516ESA-T
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 5 V | YES | -5 V | 20 Ω | 100 ns | 75 ns | SPST | CMOS | NO | 1 | 1 | 86 dB | 200 µA | 6 V | 1 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | 4.9 mm | 1.75 mm | 3.9 mm | MAXIM INTEGRATED PRODUCTS INC | 0.150 INCH, SOIC-8 | not_compliant | 8542.39.00.01 | SOIC | 8 | |||||||||||||||||
|
74HCT4316D,112
NXP Semiconductors
|
Check for Price | Yes | Transferred | 4.5 V | YES | 320 Ω | 16 Ω | 50 ns | 44 ns | SPST | CMOS | -5 V | -1 V | NO | 1 | 4 | 50 dB | SEPARATE OUTPUT | 5 V | 1 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | NXP SEMICONDUCTORS | PLASTIC, SO-16 | compliant | 8542.39.00.01 | SOP | 16 | SOT109-1 | ||||||||||||||||
|
5962H0153701VXX
Cobham Semiconductor Solutions
|
Check for Price | Transferred | 3.3 V | YES | 11 ns | 4.5 ns | CROSS POINT SWITCH | CONFIGURABLE AS QUAD 2:1 MUX, 1:2 DEMUX, REPEATER OR 1:2 SIGNAL SPLITTER | 2 | 4 | 3.6 V | 3 V | MILITARY | R-XDFP-F64 | Not Qualified | e0/e4 | 125 °C | -55 °C | MIL-PRF-38535 Class V | 1M Rad(Si) V | 64 | UNSPECIFIED | QFF | RECTANGULAR | FLATPACK | TIN LEAD/GOLD | FLAT | 635 µm | DUAL | 2.921 mm | 8.765 mm | AEROFLEX COLORADO SPRINGS | QFF, | unknown | 8542.39.00.01 | DFP | 64 | ||||||||||||||||||||||||||
|
74HC4353U
NXP Semiconductors
|
Check for Price | Obsolete | 4.5 V | YES | -4.5 V | 130 Ω | 6 Ω | 40 ns | 40 ns | SINGLE-ENDED MULTIPLEXER | CMOS | -5 V | -1 V | 2 | 3 | 50 dB | 5 V | 1 V | AUTOMOTIVE | X-XUUC-N | Not Qualified | 125 °C | -40 °C | UNSPECIFIED | UNSPECIFIED | UNCASED CHIP | NO LEAD | UPPER | NXP SEMICONDUCTORS | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||
|
MAX9392ETJ-T
Maxim Integrated Products
|
Check for Price | No | No | Obsolete | 3.3 V | YES | 574 ps | 555 ps | CROSS POINT SWITCH | 2 | 2 | 3.6 V | 3 V | INDUSTRIAL | S-XQCC-N32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 5 mm | 800 µm | 5 mm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, | compliant | 8542.39.00.01 | QFN | 32 | |||||||||||||||||||||||||
|
MAX4508CPE+
Maxim Integrated Products
|
$8.9925 | Yes | Yes | Transferred | 15 V | NO | -15 V | 400 Ω | 15 Ω | 275 ns | 200 ns | 30 mA | SINGLE-ENDED MULTIPLEXER | CMOS | FAULT PROTECTED | -20 V | -4.5 V | 8 | 1 | 70 dB | 600 µA | 20 V | 4.5 V | BREAK-BEFORE-MAKE | COMMERCIAL | R-PDIP-T16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 19.175 mm | 4.572 mm | 7.62 mm | MAXIM INTEGRATED PRODUCTS INC | DIP, DIP16,.3 | compliant | 8542.39.00.01 | DIP | 16 | EAR99 | |||||||||||
|
ISL43145IV
Renesas Electronics Corporation
|
Check for Price | No | Yes | Obsolete | 5 V | YES | -5 V | 25 Ω | 500 mΩ | 75 ns | 55 ns | SPST | CMOS | -6 V | -2 V | NO/NC | 1 | 4 | 71 dB | 1 µA | 6 V | 2 V | BREAK-BEFORE-MAKE | R-PDSO-G16 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 5 mm | 1.2 mm | 4.4 mm | RENESAS ELECTRONICS CORP | unknown | 8542.39.00.01 | TSSOP | 16 | M16.173 | Renesas Electronics | EAR99 |