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FSA2367MTCX
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Transferred | 3 V | YES | 2 Ω | 500 mΩ | 3/4 V | 60 ns | 45 ns | SPDT | 1 | 3 | 70 dB | SEPARATE OUTPUT | 4.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PDSO-G14 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 5 mm | 1.2 mm | 4.4 mm | FSA2367MTCX | FAIRCHILD SEMICONDUCTOR CORP | TSSOP | TSSOP, TSSOP14,.25 | 14 | 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE | compliant | EAR99 | 8542.39.00.01 | |||||||
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ISL84542IH-T
Intersil Corporation
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Check for Price | No | Obsolete | 3.3 V | YES | 80 Ω | 800 mΩ | 3.3/5 V | 120 ns | 50 ns | SPST | CMOS | NC | 1 | 2 | 76 dB | SEPARATE OUTPUT | 12 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | LSSOP | TSSOP8,.1 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 2.9 mm | 1.45 mm | 1.6 mm | ISL84542IH-T | INTERSIL CORP | SOT-23 | PLASTIC, SC-74, SOT-23, 8 PIN | 8 | not_compliant | 8542.39.00.01 | ||||||||||
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MC14066BCPS
Motorola Semiconductor Products
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Check for Price | No | Obsolete | NO | 5/15 V | SPST | CMOS | NO | 4 | SEPARATE OUTPUT | INDUSTRIAL | R-PDIP-T14 | Not Qualified | e0 | 85 °C | -40 °C | 14 | PLASTIC/EPOXY | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA INC | DIP, DIP14,.3 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||
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NGC3573FCT
Northrop Grumman Electronic Systems
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Check for Price | Contact Manufacturer | NORTHROP GRUMMAN ELECTRONIC SYSTEMS | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||||||||||||||||||
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5962R9581201VCC
Defense Logistics Agency
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Check for Price | Obsolete | 15 V | NO | -15 V | 50 Ω | 300 ns | 250 ns | DPST | CMOS | 2 | 2 | 40 dB | MILITARY | R-CDIP-T14 | Not Qualified | e4 | 125 °C | -55 °C | MIL-PRF-38535 Class V | 100k Rad(Si) V | 14 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | GOLD | THROUGH-HOLE | DUAL | DEFENSE LOGISTICS AGENCY | DIP | DIP, | 14 | unknown | 8542.39.00.01 | ||||||||||||||||||||||
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VSC3104XVP-01
Microsemi Corporation
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Check for Price | Obsolete | MICROSEMI CORP | , | compliant | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||||||||||||||||||
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5962-9204204M2X
Defense Logistics Agency
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Check for Price | Obsolete | 15 V | YES | -15 V | 100 Ω | 15 Ω | 150 ns | 150 ns | DIFFERENTIAL MULTIPLEXER | CMOS | 4 | 1 | MILITARY | S-CQCC-N20 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 | 20 | CERAMIC, METAL-SEALED COFIRED | QCCN | SQUARE | CHIP CARRIER | NO LEAD | QUAD | DEFENSE LOGISTICS AGENCY | QLCC | QCCN, | 20 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||
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DG154AK/883C
General Electric Solid State
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Check for Price | No | Obsolete | NO | 300 ns | DPST | BIPOLAR | NO | 2 | SEPARATE OUTPUT | MAKE-BEFORE-BREAK | MILITARY | R-XDIP-T14 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class C | 14 | CERAMIC | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GENERAL ELECTRIC SOLID STATE | DIP, DIP14,.3 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||
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DG140AL/B
General Electric Solid State
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Check for Price | No | Obsolete | YES | 500 ns | DPST | NO | 2 | SEPARATE OUTPUT | MAKE-BEFORE-BREAK | MILITARY | R-XDFP-F14 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 14 | CERAMIC | DFP | FL14,.3 | RECTANGULAR | FLATPACK | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | GENERAL ELECTRIC SOLID STATE | DFP, FL14,.3 | unknown | 8542.39.00.01 | ||||||||||||||||||||||||||
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HI1-0307-2
Thomson Consumer Electronics
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Check for Price | Obsolete | THOMSON CONSUMER ELECTRONICS | , | unknown | 8542.39.00.01 |