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ADG1433YCPZ-REEL7
Analog Devices Inc
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$5.5381 | No | Yes | Active | 5 V | YES | -5 V | 9 Ω | 550 mΩ | 545 ns | 240 ns | SPDT | CMOS | CAN ALSO OPERATES AT +/-12 V AND +/-15 V SUPPLY | -5.5 V | -4.5 V | NO/NC | 3 | 1 | 70 dB | SEPARATE OUTPUT | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 1 mm | 4 mm | ANALOG DEVICES INC | QFN | LFCSP-16 | 16 | CP-16-13 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||
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ADG1433YCPZ-REEL7
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 5 V | YES | -5 V | 9 Ω | 550 mΩ | 545 ns | 240 ns | SPDT | CMOS | CAN ALSO OPERATES AT +/-12 V AND +/-15 V SUPPLY | -5.5 V | -4.5 V | 1 | 1 | 70 dB | 5.5 V | 4.5 V | AUTOMOTIVE | S-XQCC-N16 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 650 µm | QUAD | 4 mm | 1 mm | 4 mm | ROCHESTER ELECTRONICS INC | QFN | HVQCCN, | 16 | unknown | |||||||||||
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ADG1433YCPZ-REEL
Analog Devices Inc
|
Check for Price | No | Yes | Active | 5 V | YES | -5 V | 9 Ω | 550 mΩ | 545 ns | 240 ns | SPDT | CMOS | CAN ALSO OPERATES AT +/-12 V AND +/-15 V SUPPLY | -5.5 V | -4.5 V | NO/NC | 3 | 1 | 70 dB | SEPARATE OUTPUT | 5.5 V | 4.5 V | BREAK-BEFORE-MAKE | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 3 | 125 °C | -40 °C | 260 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 1 mm | 4 mm | ANALOG DEVICES INC | QFN | LFCSP-16 | 16 | CP-16-26 | compliant | EAR99 | 8542.39.00.01 | Analog Devices |