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FPF2498BUCX
onsemi
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$0.4445 | Yes | End Of Life | 5 V | YES | +1.2V | POWER SUPPLY SUPPORT CIRCUIT | YES | 1 | 1 | 12 V | 3.5 V | R-PBGA-B6 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VFBGA | BGA6,2X3,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 400 µm | BOTTOM | 1.3 mm | 625 µm | 1.05 mm | ONSEMI | WLCSP-6 | 567RT | compliant | EAR99 | 8542.39.00.01 | onsemi | |||||||||||||||||||||||
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NCP45560IMNTWG-H
onsemi
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$1.3577 | Yes | Active | 3.3 V | YES | +0.35V | POWER SUPPLY SUPPORT CIRCUIT | NO | 1 | 1 | 750 µA | 5.5 V | 3 V | INDUSTRIAL | S-PDSO-N12 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HVSON | SOLCC12,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 1 mm | 3 mm | ONSEMI | DFN-12 | 506CD | compliant | EAR99 | 8542.39.00.01 | onsemi | DFN12 3x3, 0.5P | 12 | |||||||||||||||||||
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NCP45560IMNTWG-L
onsemi
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$0.9757 | Yes | Active | 3.3 V | YES | +0.35V | POWER SUPPLY SUPPORT CIRCUIT | NO | 1 | 1 | 750 µA | 5.5 V | 3 V | INDUSTRIAL | S-PDSO-N12 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HVSON | SOLCC12,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 1 mm | 3 mm | ONSEMI | DFN-12 | 506CD | compliant | EAR99 | 8542.39.00.01 | onsemi | DFN12 3x3, 0.5P | 12 | |||||||||||||||||||
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5962R9665103VEX
Harris Semiconductor
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Check for Price | Transferred | 15 V | NO | 320 Ω | 972 ns | 608 ns | SINGLE-ENDED MULTIPLEXER | CMOS | 2 | 3 | MILITARY | R-CDIP-T16 | Not Qualified | 125 °C | -55 °C | 100k Rad(Si) V | 16 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | IN-LINE | THROUGH-HOLE | DUAL | HARRIS SEMICONDUCTOR | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||
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MAX4742EUA+
Maxim Integrated Products
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$1.4670 | Yes | Yes | Transferred | 1.8 V | YES | 2.5 Ω | 35 ns | 25 ns | SPST | CMOS | 1 | 2 | 50 dB | 3.6 V | 1.6 V | INDUSTRIAL | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | TSSOP, | compliant | EAR99 | 8542.39.00.01 | SOIC | 8 | ||||||||||||||||||
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MAX4522CEE+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 5 V | YES | -5 V | 100 Ω | 1 Ω | 80 ns | 30 ns | SPST | CMOS | ALSO OPERATE WITH 2V TO 12V SINGLE SUPPLY | -6 V | -2 V | NO | 1 | 4 | 90 dB | SEPARATE OUTPUT | 6 V | 2 V | BREAK-BEFORE-MAKE | COMMERCIAL | R-PDSO-G16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SSOP | SSOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | MATTE TIN | GULL WING | 635 µm | DUAL | 4.89 mm | 1.75 mm | 3.9 mm | MAXIM INTEGRATED PRODUCTS INC | SSOP, SSOP16,.25 | compliant | EAR99 | 8542.39.00.01 | SSOP | 16 | ||||||||||
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IH5044MDE/883B
General Electric Solid State
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Check for Price | No | Obsolete | NO | 150 Ω | 1 µs | DPST | CMOS | NO | 1 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | MILITARY | R-XDIP-T16 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GENERAL ELECTRIC SOLID STATE | DIP, DIP16,.3 | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||
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HI3-302-5
Intersil Corporation
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Check for Price | Obsolete | 15 V | NO | -15 V | DPST | CMOS | NO | 2 | SEPARATE OUTPUT | BREAK-BEFORE-MAKE | COMMERCIAL | R-PDIP-T14 | Not Qualified | 70 °C | 14 | PLASTIC/EPOXY | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | DUAL | INTERSIL CORP | DIP, DIP14,.3 | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||
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FSAV332MTCX
Fairchild Semiconductor Corporation
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Check for Price | Yes | Obsolete | 5 V | YES | 10 Ω | 5 ns | 5 ns | SPST | CMOS | NO | 1 | 4 | 84 dB | SEPARATE OUTPUT | 5.25 V | 4.75 V | INDUSTRIAL | R-PDSO-G14 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 5 mm | 1.2 mm | 4.4 mm | FAIRCHILD SEMICONDUCTOR CORP | TSSOP, TSSOP14,.25 | unknown | 8542.39.00.01 | TSSOP | 14 | |||||||||||||||||||
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935245760125
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 5 V | YES | 142 Ω | 36 ns | 53 ns | SPST | CMOS | 1 | 1 | 50 dB | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G5 | Not Qualified | e3 | 1 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 5 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 650 µm | DUAL | 2 mm | 1.1 mm | 1.25 mm | NXP SEMICONDUCTORS | TSSOP, | compliant | 8542.39.00.01 | SOIC | 5 |