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MAX4684EUB+T
Maxim Integrated Products
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$3.4714 | Yes | Yes | Transferred | 3 V | YES | 800 mΩ | 60 mΩ | 60 ns | 40 ns | SPDT | BICMOS | 2 | 1 | 64 dB | SEPARATE OUTPUT | 3.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | TSSOP, TSSOP10,.19,20 | 10 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4684ETB+T
Maxim Integrated Products
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$2.5207 | Yes | Yes | Transferred | 3 V | YES | 800 mΩ | 60 mΩ | 60 ns | 40 ns | SPDT | BICMOS | 2 | 1 | 64 dB | SEPARATE OUTPUT | 3.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XDSO-N10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | UNSPECIFIED | HVSON | SOLCC10,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | DFN | ROHS COMPLIANT, TDFN-3 X 3 MM, 10 | 10 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4684EBC+T
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | YES | 800 mΩ | 60 mΩ | 60 ns | 40 ns | SPDT | BICMOS | 2 | 1 | 64 dB | SEPARATE OUTPUT | 3.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | 12-WLCSP-N/A | 12 | 12-WLCSP-N/A | 2001-01-03 | Analog Devices | ||||||||
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MAX4684ETB+T
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | YES | 800 mΩ | 60 mΩ | 60 ns | 40 ns | SPDT | BICMOS | 2 | 1 | 64 dB | SEPARATE OUTPUT | 3.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XDSO-N10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | UNSPECIFIED | HVSON | SOLCC10,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 3 mm | ANALOG DEVICES INC | 10-LFCSP-3X3X0.75 | ROHS COMPLIANT, TDFN-3 X 3 MM, 10 | 10 | compliant | 10-LFCSP-3X3X0.75 | 2001-01-03 | Analog Devices | |||||
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MAX4684EBC+T
Maxim Integrated Products
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$3.4714 | Yes | Yes | Transferred | 3 V | YES | 800 mΩ | 60 mΩ | 60 ns | 40 ns | SPDT | BICMOS | 2 | 1 | 64 dB | SEPARATE OUTPUT | 3.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 2.02 mm | 670 µm | 1.54 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, BGA12,3X4,20 | 12 | compliant | EAR99 | 8542.39.00.01 | |||||
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MAX4684EUB+T
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | YES | 800 mΩ | 60 mΩ | 60 ns | 40 ns | SPDT | BICMOS | 2 | 1 | 64 dB | SEPARATE OUTPUT | 3.3 V | 2.7 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | 10-MINI_SO-N/A | 10 | 10-MINI_SO-N/A | 2001-01-03 | Analog Devices | ||||||||
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MAX4684EUB+
Analog Devices Inc
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$2.3586 | Yes | Active | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-N10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | VSON | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 3 mm | 10-MINI_SO-N/A | 10 | 10-MINI_SO-N/A | 2001-01-03 | Analog Devices | |||||||||
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MAX4684EBC+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 2.02 mm | 650 µm | 1.52 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, BGA12,3X4,20 | 12 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX4684EUB
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-N10 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 10 | PLASTIC/EPOXY | VSON | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | SOIC | MICRO, SOP-10 | 10 | not_compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX4684ETB-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | YES | 800 mΩ | 60 mΩ | 50 ns | 30 ns | SPDT | 1 | 2 | 64 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PDSO-N10 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 10 | PLASTIC/EPOXY | VSON | SOLCC10,.12,20 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | VSON, SOLCC10,.12,20 | 10 | not_compliant | 8542.39.00.01 |