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MAX4754ETE
Maxim Integrated Products
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Check for Price Buy | No | No | Obsolete | 3 V | YES | 850 mΩ | 100 mΩ | 140 ns | 50 ns | SPDT | CMOS | 1 | 4 | 120 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 650 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.8 MM HEIGHT, MO220WGGC, QFN-16 | 16 | not_compliant | 8542.39.00.01 | |||||||
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MAX4754ETE+
Maxim Integrated Products
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Check for Price Buy | Yes | Yes | Transferred | 3 V | YES | 850 mΩ | 100 mΩ | 140 ns | 50 ns | SPDT | CMOS | 1 | 4 | 120 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 650 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.8 MM HEIGHT, MO220WGGC, QFN-16 | 16 | compliant | 8542.39.00.01 | EAR99 | |||||
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MAX4754ETE+T
Maxim Integrated Products
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Check for Price Buy | Yes | Yes | Transferred | 3 V | YES | 850 mΩ | 100 mΩ | 140 ns | 50 ns | SPDT | CMOS | 1 | 4 | 65 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 650 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16 | 16 | compliant | 8542.39.00.01 | EAR99 | |||||
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MAX4754ETE+T
Analog Devices Inc
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Check for Price Buy | Yes | Active | 3 V | YES | 850 mΩ | 100 mΩ | 140 ns | 50 ns | SPDT | CMOS | 1 | 4 | 65 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 800 µm | 4 mm | ANALOG DEVICES INC | 16-LFCSP-4X4X0.75 | 4 X 4 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WGGC, TQFN-16 | 16 | compliant | 16-LFCSP-4X4X0.75 | 2004-07-29 | Analog Devices | |||||
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MAX4754ETE-T
Maxim Integrated Products
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Check for Price Buy | No | No | Obsolete | 3 V | YES | 850 mΩ | 100 mΩ | 140 ns | 50 ns | SPDT | CMOS | 1 | 4 | 120 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 650 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.8 MM HEIGHT, MO220WGGC, QFN-16 | 16 | not_compliant | 8542.39.00.01 | ||||||||
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MAX4754ETE+
Analog Devices Inc
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Check for Price Buy | Yes | Active | 3 V | YES | 850 mΩ | 100 mΩ | 140 ns | 50 ns | SPDT | CMOS | 1 | 4 | 120 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 650 µm | QUAD | 4 mm | 800 µm | 4 mm | ANALOG DEVICES INC | 16-LFCSP-4X4X0.75 | 4 X 4 MM, 0.8 MM HEIGHT, MO220WGGC, QFN-16 | 16 | compliant | 16-LFCSP-4X4X0.75 | 2004-07-29 | Analog Devices |