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21 - 30 of 4,108 results
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BA6566F-T1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | TELEPHONE SPEECH CIRCUIT | 1 | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | ROHM CO LTD | SOIC | SOP-18 | 18 | compliant | 8542.39.00.01 | ||||||||||||
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BA6566FP-T1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | TELEPHONE SPEECH CIRCUIT | 1 | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | ROHM CO LTD | SOIC | HSOP-24 | 24 | compliant | 8542.39.00.01 | ||||||||||||
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BA8206F-E1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | 24 V | BIPOLAR | TELEPHONE RINGER CIRCUIT | 1 | 1.7 µA | OTHER | R-PDSO-G8 | e3/e2 | Not Qualified | 70 °C | -25 °C | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | ROHM CO LTD | SOIC | LSOP, SOP8,.25 | 8 | compliant | 8542.39.00.01 | |||||
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PCD3332-1T
NXP Semiconductors
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Check for Price | Active | TELEPHONE MULTIFUNCTION CIRCUIT | SELECTABLE MAKE/BREAK RATIO 2:1 | 3:2 | 1 | OTHER | R-PDSO-G28 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 17.9 mm | 2.65 mm | NXP SEMICONDUCTORS | SOP, | unknown | 8542.39.00.01 | |||||||||||||||
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BA8206F-T1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | TELEPHONE RINGER CIRCUIT | 1 | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | ROHM CO LTD | SOIC | SOP-8 | 8 | compliant | 8542.39.00.01 | ||||||||||||
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PCD3332-1T-T
NXP Semiconductors
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Check for Price | Active | TELEPHONE MULTIFUNCTION CIRCUIT | SELECTABLE MAKE/BREAK RATIO 2:1 | 3:2 | 1 | OTHER | R-PDSO-G28 | e4 | Not Qualified | 70 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 7.5 mm | 17.9 mm | 2.65 mm | NXP SEMICONDUCTORS | SOIC | SOP, | 28 | unknown | 8542.39.00.01 | |||||||||||
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BU8307CF-T1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | 5 V | TELEPHONE DIALER CIRCUIT | SELECTABLE MAKE/BREAK RATIO 1:2 | 1:1.5 | 1 | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | ROHM CO LTD | SOIC | SOP-24 | 24 | compliant | 8542.39.00.01 | |||||||||
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BA6566FPE2
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | TELEPHONE SPEECH CKT | 1 | R-PDSO-G26 | e3/e2 | Not Qualified | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | ROHM CO LTD | SOIC | HSSOP, | 24 | unknown | |||||||||||||
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BA8206FE2
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | TELEPHONE RINGER CKT | 1 | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | ROHM CO LTD | SOIC | LSOP, | 8 | unknown | |||||||||||||
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TEA1062/C4/M1,112
NXP Semiconductors
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Check for Price | Yes | Yes | Active | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDIP-T16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | NICKEL PALLADIUM GOLD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | NXP SEMICONDUCTORS | DIP | DIP, | 16 | compliant | 8542.39.00.01 |