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RS8228EBGB
MACOM
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Check for Price | No | Obsolete | 3.3 V | CMOS | ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE | ATM | 8 | S-PBGA-B272 | 85 °C | -40 °C | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | M/A-COM TECHNOLOGY SOLUTIONS INC | , | compliant | 8542.39.00.01 | ||||||||||
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RS8228EBGB
Conexant Systems Inc
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Check for Price | No | No | Obsolete | 3.3 V | CMOS | ATM/SONET/SDH SUPPORT CIRCUIT | ATM | 8 | INDUSTRIAL | S-PBGA-B272 | e0 | Not Qualified | 85 °C | -40 °C | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | CONEXANT SYSTEMS | BGA, BGA272,20X20,50 | compliant | 8542.39.00.01 | BGA | 272 | |||
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28228-11
Conexant Systems Inc
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Check for Price | Obsolete | 3.3 V | CMOS | ATM/SONET/SDH SUPPORT CIRCUIT | 8 | INDUSTRIAL | S-PBGA-B272 | Not Qualified | 85 °C | -40 °C | 272 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | CONEXANT SYSTEMS | BGA, | compliant | 8542.39.00.01 | BGA | 272 | |||||||||
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RS8228EBG
Conexant Systems Inc
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Check for Price | No | Obsolete | 3.3 V | CMOS | ATM/SONET/SDH SUPPORT CIRCUIT | ATM | 8 | INDUSTRIAL | S-PBGA-B272 | e0 | Not Qualified | 85 °C | -40 °C | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | CONEXANT SYSTEMS | BGA, BGA272,20X20,50 | compliant | 8542.39.00.01 | BGA | 272 | ||||
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S3029A
Applied Micro Circuits Corporation
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Check for Price | No | Obsolete | 3.3 V | ATM/SONET/SDH TRANSCEIVER | 4 | INDUSTRIAL | S-PQFP-G64 | e0 | Not Qualified | 4 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.6 mm | APPLIED MICRO CIRCUITS CORP | LFQFP, | compliant | 8542.39.00.01 | QFP | 64 | ||||||
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XRT72L74IB
Exar Corporation
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Check for Price | No | No | Obsolete | 3.3 V | CMOS | ATM/SONET/SDH NETWORK INTERFACE | ATM | 4 | INDUSTRIAL | S-PBGA-B352 | e0 | Not Qualified | 85 °C | -40 °C | 352 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 35 mm | 35 mm | 2.7 mm | EXAR CORP | BGA, | compliant | 8542.39.00.01 | BGA | 352 | ||||
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VSC8124
Microsemi Corporation
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Check for Price | Transferred | 3.3 V | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 4 | OTHER | S-PQFP-G100 | Not Qualified | 85 °C | 100 | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 2.35 mm | MICROSEMI CORP | HFQFP, | compliant | 8542.39.00.01 | |||||||||||||
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RF3734
RF Micro Devices Inc
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Check for Price | No | No | Transferred | 3.3 V | BIPOLAR | ATM/SONET/SDH SUPPORT CIRCUIT | SONET | 4 | INDUSTRIAL | R-XUUC-N54 | Not Qualified | 1 | 85 °C | -40 °C | 54 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | RF MICRO DEVICES INC | DIE, DIE OR CHIP | compliant | 8542.39.00.01 | DIE | 54 | ||||||||
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RF3734
Qorvo
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Check for Price | No | Active | 3.3 V | BIPOLAR | ATM/SONET/SDH SUPPORT CIRCUIT | 4 | INDUSTRIAL | R-XUUC-N54 | Not Qualified | 1 | 85 °C | -40 °C | 54 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | QORVO INC | DIE, DIE OR CHIP | compliant | 8542.39.00.01 | ||||||||||||
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VSC8124
Vitesse Semiconductor Corporation
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Check for Price | Transferred | 3.3 V | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 4 | OTHER | S-PQFP-G100 | Not Qualified | 85 °C | 100 | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 2.35 mm | VITESSE SEMICONDUCTOR CORP | HFQFP, | compliant | 8542.39.00.01 | QFP | 100 |