Parametric results for: ATM/SONET/SDH ICs

Filter Your Search

1 - 10 of 3,090,397 results

|
-
-
-
-
-
-
-
-
Sorted By: Number of Functions
Select parts from the table below to compare.
Compare
Compare
RS8228EBGB
MACOM
Check for Price No Obsolete 3.3 V CMOS ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM 8 S-PBGA-B272 85 °C -40 °C 272 PLASTIC/EPOXY BGA BGA272,20X20,50 SQUARE GRID ARRAY YES BALL 1.27 mm BOTTOM 27 mm 27 mm 2.54 mm M/A-COM TECHNOLOGY SOLUTIONS INC , compliant 8542.39.00.01
RS8228EBGB
Conexant Systems Inc
Check for Price No No Obsolete 3.3 V CMOS ATM/SONET/SDH SUPPORT CIRCUIT ATM 8 INDUSTRIAL S-PBGA-B272 e0 Not Qualified 85 °C -40 °C 272 PLASTIC/EPOXY BGA BGA272,20X20,50 SQUARE GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 27 mm 27 mm 2.54 mm CONEXANT SYSTEMS BGA, BGA272,20X20,50 compliant 8542.39.00.01 BGA 272
28228-11
Conexant Systems Inc
Check for Price Obsolete 3.3 V CMOS ATM/SONET/SDH SUPPORT CIRCUIT 8 INDUSTRIAL S-PBGA-B272 Not Qualified 85 °C -40 °C 272 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL 1.27 mm BOTTOM 27 mm 27 mm 2.54 mm CONEXANT SYSTEMS BGA, compliant 8542.39.00.01 BGA 272
RS8228EBG
Conexant Systems Inc
Check for Price No Obsolete 3.3 V CMOS ATM/SONET/SDH SUPPORT CIRCUIT ATM 8 INDUSTRIAL S-PBGA-B272 e0 Not Qualified 85 °C -40 °C 272 PLASTIC/EPOXY BGA BGA272,20X20,50 SQUARE GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 27 mm 27 mm 2.54 mm CONEXANT SYSTEMS BGA, BGA272,20X20,50 compliant 8542.39.00.01 BGA 272
S3029A
Applied Micro Circuits Corporation
Check for Price No Obsolete 3.3 V ATM/SONET/SDH TRANSCEIVER 4 INDUSTRIAL S-PQFP-G64 e0 Not Qualified 4 85 °C -40 °C 64 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 10 mm 10 mm 1.6 mm APPLIED MICRO CIRCUITS CORP LFQFP, compliant 8542.39.00.01 QFP 64
XRT72L74IB
Exar Corporation
Check for Price No No Obsolete 3.3 V CMOS ATM/SONET/SDH NETWORK INTERFACE ATM 4 INDUSTRIAL S-PBGA-B352 e0 Not Qualified 85 °C -40 °C 352 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 35 mm 35 mm 2.7 mm EXAR CORP BGA, compliant 8542.39.00.01 BGA 352
VSC8124
Microsemi Corporation
Check for Price Transferred 3.3 V ATM/SONET/SDH CLOCK RECOVERY CIRCUIT 4 OTHER S-PQFP-G100 Not Qualified 85 °C 100 PLASTIC/EPOXY HFQFP SQUARE FLATPACK, HEAT SINK/SLUG, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 2.35 mm MICROSEMI CORP HFQFP, compliant 8542.39.00.01
RF3734
RF Micro Devices Inc
Check for Price No No Transferred 3.3 V BIPOLAR ATM/SONET/SDH SUPPORT CIRCUIT SONET 4 INDUSTRIAL R-XUUC-N54 Not Qualified 1 85 °C -40 °C 54 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP YES NO LEAD UPPER RF MICRO DEVICES INC DIE, DIE OR CHIP compliant 8542.39.00.01 DIE 54
RF3734
Qorvo
Check for Price No Active 3.3 V BIPOLAR ATM/SONET/SDH SUPPORT CIRCUIT 4 INDUSTRIAL R-XUUC-N54 Not Qualified 1 85 °C -40 °C 54 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP YES NO LEAD UPPER QORVO INC DIE, DIE OR CHIP compliant 8542.39.00.01
VSC8124
Vitesse Semiconductor Corporation
Check for Price Transferred 3.3 V ATM/SONET/SDH CLOCK RECOVERY CIRCUIT 4 OTHER S-PQFP-G100 Not Qualified 85 °C 100 PLASTIC/EPOXY HFQFP SQUARE FLATPACK, HEAT SINK/SLUG, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 2.35 mm VITESSE SEMICONDUCTOR CORP HFQFP, compliant 8542.39.00.01 QFP 100