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Parametric results for: Cordless Telephone ICs

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MC33410FTA
 Motorola Mobility LLC 		Check for Price No Obsolete 3.6 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 2 16 mA COMMERCIAL S-PQFP-G48 e0 Not Qualified 70 °C -20 °C 48 PLASTIC/EPOXY LFQFP QFP48,.35SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 7 mm 7 mm 1.6 mm MOTOROLA INC QFP LFQFP, QFP48,.35SQ,20 48 unknown 8542.39.00.01
MC33410FTA
 Motorola Semiconductor Products 		Check for Price No Obsolete 3.6 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 2 16 mA COMMERCIAL S-PQFP-G48 e0 Not Qualified 70 °C -20 °C 48 PLASTIC/EPOXY LFQFP QFP48,.35SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 7 mm 7 mm 1.6 mm MOTOROLA INC LFQFP, QFP48,.35SQ,20 unknown 8542.39.00.01
SC14402DVJG
 Texas Instruments 		Check for Price No Obsolete 3 V CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 e0 Not Qualified 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, QFP100,.63SQ,20 unknown 8542.39.00.01
KS8803B
 Samsung Semiconductor 		Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 µA COMMERCIAL EXTENDED R-PDIP-T16 e0 Not Qualified 75 °C -30 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.4 mm 5.08 mm SAMSUNG SEMICONDUCTOR INC DIP DIP, DIP16,.3 16 compliant 8542.39.00.01
SC14402CRVJG
 Texas Instruments 		Check for Price Obsolete 3 V CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 Not Qualified 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, QFP100,.63SQ,20 unknown 8542.39.00.01
SC14405AXXAG
 National Semiconductor Corporation 		Check for Price Obsolete CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 Not Qualified 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, unknown 8542.39.00.01
MC13110AFB
 Motorola Semiconductor Products 		Check for Price No Obsolete 3.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 10.5 mA INDUSTRIAL S-PQFP-G52 e0 Not Qualified 85 °C -40 °C 52 PLASTIC/EPOXY QFP QFP52,.52SQ SQUARE FLATPACK YES TIN LEAD GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm MOTOROLA INC QFP, QFP52,.52SQ unknown 8542.39.00.01
935237440118
 NXP Semiconductors 		Check for Price Obsolete 2.9 V CORDLESS TELEPHONE BASEBAND CIRCUIT 1 1.4 mA COMMERCIAL EXTENDED R-PDSO-G16 Not Qualified 75 °C -25 °C 16 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5.2 mm 1.5 mm NXP SEMICONDUCTORS SOIC LSSOP, 16 unknown 8542.39.00.01
UBA1706TS
 NXP Semiconductors 		Check for Price Obsolete 3.3 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 3.2 µA COMMERCIAL EXTENDED R-PDSO-G24 e4 Not Qualified 75 °C -25 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm NXP SEMICONDUCTORS SSOP SSOP, SSOP24,.3 24 compliant 8542.39.00.01
NCL354TMX
 National Semiconductor Corporation 		Check for Price Obsolete 3.3 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G56 Not Qualified 80 °C -30 °C 56 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 6.1 mm 14 mm 1.1 mm NATIONAL SEMICONDUCTOR CORP TSSOP, unknown 8542.39.00.01
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