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935277007112
NXP Semiconductors
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Check for Price | Obsolete | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 8.5 mA | INDUSTRIAL | R-PDSO-G20 | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.5 mm | NXP SEMICONDUCTORS | LSSOP, | unknown | ||||||||||||||
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AK2353LV
Asahi Kasei Microsystems Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER | 1 | 9.4 mA | COMMERCIAL | S-PQFP-G64 | e0 | Not Qualified | 70 °C | -10 °C | 64 | PLASTIC/EPOXY | QFP | QFP64,.47SQ,20 | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | ASAHI KASEI MICRODEVICES CORP | QFP, QFP64,.47SQ,20 | unknown | 8542.39.00.01 | ||||||||||
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KS8803BD
Samsung Semiconductor
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 7 µA | COMMERCIAL EXTENDED | R-PDSO-G16 | e0 | Not Qualified | 75 °C | -30 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 3.95 mm | 9.9 mm | 1.95 mm | SAMSUNG SEMICONDUCTOR INC | SOP, SOP16,.25 | compliant | 8542.39.00.01 | SOIC | 16 | |||||
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BU8242FT1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 8 mA | R-PDSO-G20 | e3/e2 | Not Qualified | 260 | 10 | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 12.5 mm | 1.9 mm | ROHM CO LTD | SOP-20 | compliant | 8542.39.00.01 | SOIC | 20 | |||||||
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SM5132DS
Seiko NPC Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 80 °C | -30 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | SEIKO NPC CORP | SOP, SOP16,.25 | unknown | 8542.39.00.01 | ||||||||||||
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BU8241FE1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 8 mA | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | ROHM CO LTD | SOP, | compliant | 8542.39.00.01 | SOIC | 24 | |||||||
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TA31102F(ER)
Toshiba America Electronic Components
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Check for Price | No | No | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | OTHER | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | TOSHIBA CORP | SSOP, | unknown | 8542.39.00.01 | SOIC | 16 | ||||||
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TA31102F-TP1
Toshiba America Electronic Components
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Check for Price | No | No | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | OTHER | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | TOSHIBA CORP | SSOP, | unknown | 8542.39.00.01 | SOIC | 16 | ||||||
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KS8803B
Samsung Semiconductor
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 7 µA | COMMERCIAL EXTENDED | R-PDIP-T16 | e0 | Not Qualified | 75 °C | -30 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.4 mm | 5.08 mm | SAMSUNG SEMICONDUCTOR INC | DIP, DIP16,.3 | compliant | 8542.39.00.01 | DIP | 16 | |||||
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LA8518NM
SANYO Electric Co Ltd
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Check for Price | No | Obsolete | 5 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL | S-PQFP-G64 | e0 | Not Qualified | 70 °C | -20 °C | 64 | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 14 mm | 14 mm | 3 mm | SANYO ELECTRIC CO LTD | QFP, QFP64,.66SQ,32 | unknown | 8542.39.00.01 | QFP | 64 |