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Part Number |
Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Supply Voltage-Nom | Technology |
Carrier Type
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Telecom IC Type
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Number of Functions |
Power Supplies
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Supply Current-Max
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Temperature Grade
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JESD-30 Code
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JESD-609 Code
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Qualification Status
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Width
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Length
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Seated Height-Max
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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HTS Code
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Part Package Code
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Pin Count
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ECCN Code
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MT8976APR1
Zarlink Semiconductor Inc
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Check for Price | Yes | Obsolete | 5 V | FRAMER | 1 | INDUSTRIAL | S-PQCC-J44 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | ZARLINK SEMICONDUCTOR INC | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | 8542.39.00.01 | |||||||||||
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DS21FT44N
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | CMOS | FRAMER | 1 | 3.3 V | INDUSTRIAL | S-PBGA-B300 | e0 | Not Qualified | 4 | 85 °C | -40 °C | 300 | PLASTIC/EPOXY | BGA | BGA300,20X20,50 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | MAXIM INTEGRATED PRODUCTS INC | 27 X 27 MM, 1.27 MM PITCH, MCMBGA-300 | not_compliant | 8542.39.00.01 | BGA | 300 | EAR99 | ||||||
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T7111A-PC
LSI Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 5 V | 55 mA | COMMERCIAL | R-PDIP-T28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | AGERE SYSTEMS INC | DIP, DIP28,.6 | unknown | ||||||||||||||||
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BT8954
Mindspeed Technologies Inc
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Check for Price | Obsolete | 5 V | FRAMER | 1 | INDUSTRIAL | S-PQCC-J68 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 5.08 mm | MINDSPEED TECHNOLOGIES INC | QCCJ, | compliant | 8542.39.00.01 | LCC | 68 | |||||||||||||||
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DS2143Q
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | 1 | 5 V | COMMERCIAL | S-PQCC-J44 | e0 | Not Qualified | 3 | 70 °C | 245 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | MAXIM INTEGRATED PRODUCTS INC | PLASTIC, LCC-44 | not_compliant | 8542.31.00.01 | LCC | 44 | EAR99 | |||||
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PM4359-NI
Microsemi Corporation
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Check for Price | No | Transferred | 1.8 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B256 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROSEMI CORP | 17 X 17 MM, CABGA-256 | unknown | 8542.39.00.01 | ||||||||||||||||||
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PEB2052-N
Siemens
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Check for Price | Transferred | 5 V | TIME SLOT ASSIGNER | 1 | S-PQCC-J44 | Not Qualified | 44 | PLASTIC/EPOXY | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | SIEMENS A G | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||||
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BT8376EPF
Rockwell Automation
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Check for Price | Contact Manufacturer | 5 V | FRAMER | 1 | 175 mA | INDUSTRIAL | S-PQFP-G80 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | ROCKWELL AUTOMATION | , | compliant | 8542.39.00.01 | |||||||||||||||||||||
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MT8977AE
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 V | CMOS | FRAMER | 1 | 5 V | 10 mA | INDUSTRIAL | R-PDIP-T28 | e0 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MITEL SEMICONDUCTOR | DIP, DIP28,.6 | unknown | 8542.39.00.01 | DIP | 28 | ||||||||||
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DS2155GNB
Rochester Electronics LLC
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Check for Price | No | No | Active | 3.3 V | FRAMER | 1 | INDUSTRIAL | S-PBGA-B100 | COMMERCIAL | 1 | 85 °C | -40 °C | 225 | NOT SPECIFIED | 100 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | YES | NOT SPECIFIED | BALL | 800 µm | BOTTOM | 10 mm | 10 mm | ROCHESTER ELECTRONICS LLC | 10 X 10 MM, CSBGA-100 | unknown | BGA | 100 |