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21 - 30 of 1,403 results
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LXP2181APE
Intel Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | 1 | 10 mA | INDUSTRIAL | S-PQCC-J44 | e0 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.57 mm | INTEL CORP | LCC | QCCJ, LDCC44,.7SQ | 44 | compliant | 8542.39.00.01 | |||||||
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DS2153Q-A7+T&R
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 5 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PQCC-J44 | e3 | Not Qualified | 3 | 70 °C | 260 | 30 | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.572 mm | MAXIM INTEGRATED PRODUCTS INC | LCC | QCCJ, | 44 | compliant | 8542.39.00.01 | EAR99 | ||||||
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CN8330EPJD
Conexant Systems Inc
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 175 µA | INDUSTRIAL | S-PQCC-J68 | e0 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 5.08 mm | CONEXANT SYSTEMS | LCC | QCCJ, LDCC68,1.0SQ | 68 | unknown | 8542.39.00.01 | ||||||||
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DS2154LD1
Rochester Electronics LLC
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Check for Price | No | No | Active | 5 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PQFP-G100 | e0 | COMMERCIAL | 3 | 70 °C | 245 | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | ROCHESTER ELECTRONICS LLC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, LQFP-100 | 100 | unknown | ||||||||
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TFRA08C13
Broadcom Limited
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Check for Price | Active | 3.3 V | CMOS | FRAMER | 8 | X-PBGA-B352 | e0 | Not Qualified | 225 | 30 | 352 | PLASTIC/EPOXY | BGA | UNSPECIFIED | GRID ARRAY | YES | TIN LEAD | BALL | BOTTOM | BROADCOM LTD | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||||
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CX28346
Mindspeed Technologies Inc
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Check for Price | No | No | Transferred | 2.5 V | FRAMER | 1 | INDUSTRIAL | S-PBGA-B318 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 318 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | MINDSPEED TECHNOLOGIES INC | BGA | BGA, | 318 | compliant | 8542.39.00.01 | ||||||||||
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MV1445DG
Dynex Semiconductor
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Check for Price | Obsolete | 5 V | CMOS | TIME SLOT 0/16 TRANSCEIVER | 1 | R-GDIP-T40 | Not Qualified | 40 | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | GEC PLESSEY SEMICONDUCTORS | , | unknown | 8542.39.00.01 | |||||||||||||||||||||||
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XRT86L38IB
Exar Corporation
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Check for Price | No | Obsolete | 3.3 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B420 | e0 | Not Qualified | 4 | 85 °C | -40 °C | 215 | 30 | 420 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 35 mm | 35 mm | 1.7 mm | EXAR CORP | BGA | LBGA, | 420 | compliant | 8542.39.00.01 | |||||||
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BT8375EPF
Rockwell Automation
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Check for Price | Contact Manufacturer | 5 V | CMOS | FRAMER | 1 | 175 mA | INDUSTRIAL | S-PQFP-G80 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | ROCKWELL AUTOMATION | , | compliant | 8542.39.00.01 | |||||||||||||||||||
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DS34S104GN
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 1.8 V | FRAMER | 1 | 280 mA | INDUSTRIAL | S-PBGA-B256 | e0 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | TECSBGA-256 | 256 | not_compliant | 8542.39.00.01 | EAR99 |