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31 - 40 of 1,403 results
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T8100A--BAL3-DB
LSI Corporation
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Check for Price | No | Transferred | 3.3 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B217 | Not Qualified | 85 °C | -40 °C | 217 | PLASTIC/EPOXY | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | LUCENT TECHNOLOGIES INC | BGA | , | 217 | unknown | 8542.39.00.01 | ||||||||||||||||||
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DS3170+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 3.3 V | FRAMER | 1 | 145 mA | COMMERCIAL | S-PBGA-B100 | e3 | Not Qualified | 3 | 70 °C | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | MATTE TIN | BALL | 1 mm | BOTTOM | 11 mm | 11 mm | 1.5 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 11 X 11 MM, 1.40 MM THICKNESS, 1 MM PITCH, CSBGA-100 | 100 | compliant | 8542.39.00.01 | EAR99 | |||||||
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TFRA28J133BAL-1-DB
Avago Technologies
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Check for Price | Active | 3.3 V | FRAMER | 1 | INDUSTRIAL | S-PBGA-B456 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 456 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 35 mm | 35 mm | 2.54 mm | AVAGO TECHNOLOGIES INC | BGA, | unknown | 8542.39.00.01 | ||||||||||||
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BT8071AKPQ
Conexant Systems Inc
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | COMMERCIAL | R-PQIP-T64 | e0 | Not Qualified | 70 °C | 64 | PLASTIC/EPOXY | QIP | QUIP64A,.7/.9 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 1.27 mm | QUAD | BROOKTREE CORP | QIP, QUIP64A,.7/.9 | unknown | 8542.39.00.01 | |||||||||||||||
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MC14417L
Motorola Mobility LLC
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Check for Price | No | Obsolete | 12 V | CMOS | TIME SLOT ASSIGNER | 1 | 2.5 mA | INDUSTRIAL | R-GDIP-T18 | e0 | Not Qualified | 85 °C | -40 °C | 18 | CERAMIC, GLASS-SEALED | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.73 mm | 5.08 mm | MOTOROLA INC | DIP | DIP, DIP18,.3 | 18 | unknown | 8542.39.00.01 | ||||||||
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PEF22554EV31SLL6X
Intel Corporation
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Check for Price | Obsolete | FRAMER | INTEL CORP | , | compliant | 8542.39.00.01 | 2017-10-28 | ||||||||||||||||||||||||||||||||||
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MT8977AP
Zarlink Semiconductor Inc
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 10 mA | INDUSTRIAL | S-PQCC-J44 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | ZARLINK SEMICONDUCTOR INC | PLASTIC, MS-018AC, LCC-44 | compliant | 8542.39.00.01 | ||||||||
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PEB20560V2.1
Infineon Technologies AG
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Check for Price | Transferred | 3.3 V | CMOS | TIME SLOT ASSIGNER | 1 | 115 mA | COMMERCIAL | S-PQFP-G160 | Not Qualified | 70 °C | 160 | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 28 mm | 28 mm | 2.75 mm | INFINEON TECHNOLOGIES AG | QFP | METRIC, PLASTIC, QFP-160 | 160 | compliant | 8542.39.00.01 | ||||||||||||
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TTSI1K16T
Avago Technologies
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Check for Price | Active | 3.3 V | CMOS | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PQFP-G144 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | AVAGO TECHNOLOGIES INC | LFQFP, | unknown | 8542.39.00.01 | |||||||||||
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MT9072AB
Microsemi Corporation
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Check for Price | No | Transferred | 3.3 V | FRAMER | 8 | INDUSTRIAL | S-PQFP-G208 | Not Qualified | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | MITEL SEMICONDUCTOR | QFP | , | 208 | unknown | 8542.39.00.01 |