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41 - 50 of 1,403 results
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MT9074AP
Microsemi Corporation
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Check for Price | No | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 200 mA | INDUSTRIAL | S-PQCC-J68 | e0 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | MICROSEMI CORP | LCC | PLASTIC, MS-018AE, LCC-68 | 68 | unknown | 8542.39.00.01 | ||||||||
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DS2154LA2+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 5 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PQFP-G100 | e3 | Not Qualified | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | LFQFP, | 100 | compliant | 8542.39.00.01 | |||||||
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CN8394KTF
Conexant Systems Inc
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Check for Price | No | Transferred | 3.3 V | CMOS | FRAMER | 90 mA | COMMERCIAL | R-PQFP-G128 | e0 | Not Qualified | 70 °C | 128 | PLASTIC/EPOXY | QFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | CONEXANT SYSTEMS | QFP, QFP128,.63X.87,20 | compliant | 8542.39.00.01 | |||||||||||||||
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IDT82V8313DSG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 3.3 V | FRAMER | 1 | 185 mA | INDUSTRIAL | S-PQFP-G208 | e3 | Not Qualified | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 28 mm | 28 mm | 4.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 28 X 28 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFP-208 | 208 | compliant | 8542.39.00.01 | ||||||||||
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TTSI016641BL-1
LSI Corporation
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Check for Price | No | Transferred | 1.5 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B324 | Not Qualified | 85 °C | -40 °C | 324 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.51 mm | AGERE SYSTEMS INC | BGA | BGA, | 324 | unknown | 8542.39.00.01 | |||||||||||||
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BT9170KP
Conexant Systems Inc
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Check for Price | Obsolete | 5 V | CMOS | FRAMER | 1 | 15 mA | COMMERCIAL | R-PDIP-T40 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | BROOKTREE CORP | , | unknown | 8542.39.00.01 | ||||||||||||||||||||
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PEB2255-H
Infineon Technologies AG
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Check for Price | No | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | 140 mA | INDUSTRIAL | S-PQFP-G80 | e0 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.45 mm | INFINEON TECHNOLOGIES AG | QFP | PLASTIC, MQFP-80 | 80 | not_compliant | 8542.39.00.01 | ||||||
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PEF22554HT
Intel Corporation
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Check for Price | Yes | Contact Manufacturer | 1.8 V | FRAMER | 1 | 230 mA | INDUSTRIAL | S-PBGA-B160 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 160 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.6 mm | INTEL CORP | GREEN, PLASTIC, LBGA-160 | compliant | 8542.39.00.01 | ||||||||||||
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TXC-03401-ABA
Transwitch Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 150 mA | S-PQCC-J68 | e0 | Not Qualified | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | TRANSWITCH CORP | QCCJ, LDCC68,1.0SQ | unknown | 8542.39.00.01 | ||||||||||||||||
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DS2182N
Rochester Electronics LLC
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Check for Price | No | No | Active | 5 V | CMOS | FRAMER | 1 | COMMERCIAL | R-PDIP-T28 | e0 | COMMERCIAL | 1 | 70 °C | 245 | NOT SPECIFIED | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 36.83 mm | 5.08 mm | ROCHESTER ELECTRONICS LLC | DIP | 0.600 INCH, DIP-28 | 28 | unknown |