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11 - 20 of 1,403 results
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PM8310A-FEI
Microchip Technology Inc
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$791.6142 | Yes | Active | FRAMER | 1 | INDUSTRIAL | S-PBGA-B896 | 85 °C | -40 °C | 896 | PLASTIC/EPOXY | SQUARE | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | HBBGA-896 | compliant | Microchip | |||||||||||||||||||||||||
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PM5326-FEI
Microchip Technology Inc
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$1,035.9586 | Active | 1.2 V | FRAMER | 1 | S-PBGA-B1292 | 1292 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | FCBGA-1292 | compliant | 5A991.B | 8542.31.00.01 | |||||||||||||||||||||||||
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PEB20560V2.1
Infineon Technologies AG
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Check for Price | Transferred | 3.3 V | CMOS | TIME SLOT ASSIGNER | 1 | 115 mA | COMMERCIAL | S-PQFP-G160 | Not Qualified | 70 °C | 160 | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 28 mm | 28 mm | 2.75 mm | INFINEON TECHNOLOGIES AG | METRIC, PLASTIC, QFP-160 | compliant | 8542.39.00.01 | QFP | 160 | ||||||||||||||
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TTSI1K16T
Avago Technologies
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Check for Price | Active | 3.3 V | CMOS | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PQFP-G144 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | AVAGO TECHNOLOGIES INC | LFQFP, | unknown | 8542.39.00.01 | |||||||||||||
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MT9072AV2
Microsemi Corporation
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Check for Price | Yes | Yes | Obsolete | 3.3 V | FRAMER | 8 | INDUSTRIAL | S-PBGA-B220 | e1 | Not Qualified | 85 °C | -40 °C | 220 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.5 mm | MICROSEMI CORP | 17 X 17 MM, 1.30 MM HEIGHT, LEAD FREE, PLASTIC, MO-192, LBGA-220 | compliant | 8542.39.00.01 | BGA | 220 | ||||||||||||
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DS2151QBX/T&R
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | CMOS | T-1(DS1) | FRAMER | 1 | COMMERCIAL | S-PQCC-J44 | e0 | Not Qualified | 3 | 70 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.572 mm | MAXIM INTEGRATED PRODUCTS INC | 0.652 INCH, PLASTIC, LCC-44 | not_compliant | 8542.39.00.01 | LCC | 44 | |||||||||
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MT8977AP
Zarlink Semiconductor Inc
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 10 mA | INDUSTRIAL | S-PQCC-J44 | e0 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | ZARLINK SEMICONDUCTOR INC | PLASTIC, MS-018AC, LCC-44 | compliant | 8542.39.00.01 | ||||||||||
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DS3120
Maxim Integrated Products
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Check for Price | No | Obsolete | 1.8 V | CMOS | FRAMER | 28 | COMMERCIAL | S-PBGA-B316 | e0 | Not Qualified | 70 °C | 316 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.53 mm | MAXIM INTEGRATED PRODUCTS INC | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-316 | compliant | ||||||||||||||||
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PEF22554EV31SLL6X
Intel Corporation
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Check for Price | Obsolete | FRAMER | INTEL CORP | , | compliant | 8542.39.00.01 | 2017-10-28 | ||||||||||||||||||||||||||||||||||||
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MC14417L
Motorola Mobility LLC
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Check for Price | No | Obsolete | 12 V | CMOS | TIME SLOT ASSIGNER | 1 | 2.5 mA | INDUSTRIAL | R-GDIP-T18 | e0 | Not Qualified | 85 °C | -40 °C | 18 | CERAMIC, GLASS-SEALED | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.73 mm | 5.08 mm | MOTOROLA INC | DIP, DIP18,.3 | unknown | 8542.39.00.01 | DIP | 18 |