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51 - 60 of 1,403 results
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KT8555
Samsung Semiconductor
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Check for Price | Obsolete | 5 V | TIME SLOT ASSIGNER | 1 | 1.5 mA | R-GDIP-T20 | Not Qualified | 20 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 25.855 mm | 5.08 mm | SAMSUNG SEMICONDUCTOR INC | DIP | DIP, | 20 | unknown | 8542.39.00.01 | ||||||||||||||||
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DS21Q43ATN
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 5 V | CMOS | FRAMER | 4 | INDUSTRIAL | R-PQFP-G128 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 128 | PLASTIC/EPOXY | LFQFP | QFP128,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | TQFP-128 | 128 | not_compliant | 8542.39.00.01 | |||||||
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RS8953SPBEPF
Conexant Systems Inc
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Check for Price | No | No | Obsolete | 3.3 V | CMOS | 1.168 Gbps | FRAMER | 1 | 21.1 mA | INDUSTRIAL | R-PQFP-G80 | e0 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 14 mm | 20 mm | 3.1 mm | CONEXANT SYSTEMS | QFP | QFP-80 | 80 | compliant | 8542.39.00.01 | ||||||
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CN8394KTF
Conexant Systems Inc
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Check for Price | No | Transferred | 3.3 V | CMOS | FRAMER | 90 mA | COMMERCIAL | R-PQFP-G128 | e0 | Not Qualified | 70 °C | 128 | PLASTIC/EPOXY | QFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | CONEXANT SYSTEMS | QFP, QFP128,.63X.87,20 | compliant | 8542.39.00.01 | |||||||||||||||
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IDT82V8313DSG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 3.3 V | FRAMER | 1 | 185 mA | INDUSTRIAL | S-PQFP-G208 | e3 | Not Qualified | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 28 mm | 28 mm | 4.1 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 28 X 28 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFP-208 | 208 | compliant | 8542.39.00.01 | ||||||||||
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BT9170KP
Conexant Systems Inc
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Check for Price | Obsolete | 5 V | CMOS | FRAMER | 1 | 15 mA | COMMERCIAL | R-PDIP-T40 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | BROOKTREE CORP | , | unknown | 8542.39.00.01 | ||||||||||||||||||||
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PEB2255-H
Infineon Technologies AG
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Check for Price | No | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | 140 mA | INDUSTRIAL | S-PQFP-G80 | e0 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.45 mm | INFINEON TECHNOLOGIES AG | QFP | PLASTIC, MQFP-80 | 80 | not_compliant | 8542.39.00.01 | ||||||
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DS26524GN
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3.3 V | BIPOLAR | CEPT PCM-30/E-1 | TIME SLOT 0/16 TRANSCEIVER | T-1(DS1) | 1 | 450 µA | INDUSTRIAL | S-PBGA-B256 | Not Qualified | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 17 X 17 MM, 1 MM PITCH, TE-CSBGA-256 | 256 | not_compliant | 8542.39.00.01 | EAR99 | |||||
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TSS933EBSC
Atmel Corporation
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Check for Price | Obsolete | 5 V | BICMOS | FRAMER | 1 | MILITARY | S-CQCC-N28 | Not Qualified | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | QCCN | SQUARE | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 11.49 mm | 11.49 mm | 2.03 mm | ATMEL CORP | QLCC | QCCN, | 28 | unknown | 8542.39.00.01 | |||||||||||||
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DS2180AQ
Dallas Semiconductor
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Check for Price | No | Transferred | 5 V | CMOS | T-1(DS1) | FRAMER | 1 | 10 mA | COMMERCIAL | S-PQCC-J44 | e0 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | DALLAS SEMICONDUCTOR | PLASTIC, LCC-44 | unknown |