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11 - 20 of 1,403 results
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PM8310A-FEI
Microchip Technology Inc
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$791.6142 | Yes | Active | FRAMER | 1 | INDUSTRIAL | S-PBGA-B896 | 85 °C | -40 °C | 896 | PLASTIC/EPOXY | SQUARE | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | HBBGA-896 | compliant | Microchip | |||||||||||||||||||||||||
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PM5326-FEI
Microchip Technology Inc
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$1,035.9586 | Active | 1.2 V | FRAMER | 1 | S-PBGA-B1292 | 1292 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | FCBGA-1292 | compliant | 5A991.B | 8542.31.00.01 | |||||||||||||||||||||||||
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PM4351-RI
PMC-Sierra Inc
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Check for Price | No | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PQFP-G80 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.35 mm | PMC-SIERRA INC | 14 X 14 MM, 2 MM HEIGHT, METRIC, PLASTIC, QFP-80 | compliant | 8542.39.00.01 | ||||||||||
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DS21Q43FP
Maxim Integrated Products
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Check for Price | Obsolete | 5 V | CMOS | FRAMER | 4 | R-PQFP-G80 | e0 | Not Qualified | 80 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 14 mm | 20 mm | 3.4 mm | MAXIM INTEGRATED PRODUCTS INC | QFP, | compliant | 8542.39.00.01 | QFP | 80 | ||||||||||||||||
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BT8200
Conexant Systems Inc
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Check for Price | No | Transferred | 5 V | FRAMER | INDUSTRIAL | S-PQCC-J84 | e0 | Not Qualified | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | CONEXANT SYSTEMS | QCCJ, LDCC84,1.2SQ | compliant | 8542.39.00.01 | LCC | 84 | ||||||||||||||||
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DS3134
Rochester Electronics LLC
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Check for Price | No | No | Active | 3.3 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PBGA-B256 | e0 | COMMERCIAL | NOT SPECIFIED | 70 °C | 225 | NOT SPECIFIED | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.34 mm | ROCHESTER ELECTRONICS LLC | 27 X 27 MM, PLASTIC, BGA-256 | unknown | BGA | 256 | ||||||||||
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MT8979APR
Microsemi Corporation
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Check for Price | No | No | Transferred | 5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | 1 | 16 mA | INDUSTRIAL | S-PQCC-J44 | e0 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | MICROSEMI CORP | PLASTIC, MS-018AC, LCC-44 | unknown | 8542.39.00.01 | LPCC | 44 | ||||||||
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TSS933EASC
Temic Semiconductors
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Check for Price | Obsolete | 5 V | BICMOS | FRAMER | 1 | MILITARY | S-XQFP-G28 | Not Qualified | 125 °C | -55 °C | 28 | UNSPECIFIED | SQUARE | FLATPACK | YES | GULL WING | QUAD | TEMIC SEMICONDUCTORS | MQFPJ-28 | unknown | |||||||||||||||||||||||
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TTSI4K32T
Avago Technologies
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Check for Price | Active | 3.3 V | CMOS | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B217 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 217 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.32 mm | AVAGO TECHNOLOGIES INC | BGA, | unknown | 8542.39.00.01 | |||||||||||||
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XRT74L73IB
Exar Corporation
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Check for Price | No | Obsolete | 3.3 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B388 | e0 | Not Qualified | 4 | 85 °C | -40 °C | 215 | 30 | 388 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 35 mm | 35 mm | 2.7 mm | EXAR CORP | BGA, | compliant | 8542.39.00.01 | BGA | 388 |