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21 - 30 of 4,386 results
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A5191HRTLG-XTD
onsemi
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$6.9191 | Yes | Obsolete | 3.3 V | CMOS | 1 Mbps | MODEM | 1 | 600 nA | INDUSTRIAL | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | ONSEMI | LQFP32, 7x7 | LQFP-32 | 32 | 561AB | compliant | 8542.39.00.01 | onsemi | ||||||
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A5191HRTPG-XTD
onsemi
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$7.0531 | Yes | Obsolete | 3.3 V | CMOS | 1 Mbps | MODEM | 1 | 600 nA | INDUSTRIAL | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | ONSEMI | PLCC-28 | LCC-28 | 28 | 776AA | compliant | 8542.39.00.01 | onsemi | ||||||
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MPL360B-I/Y8X
Microchip Technology Inc
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$8.6494 | Active | 3.3 V | MODEM | 1 | INDUSTRIAL | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MICROCHIP TECHNOLOGY INC | TQFP-48 | compliant | 8542.39.00.01 | Microchip | 5A992.C | ||||||||||||||||||
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DS8500-JND+
Maxim Integrated Products
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$8.8955 | Yes | Yes | Transferred | 1 Mbps | MODEM | 1 | 285 nA | INDUSTRIAL | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | 5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, TQFN-20 | 20 | compliant | 8542.39.00.01 | EAR99 | ||||||||
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ST7540
STMicroelectronics
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$10.4394 | Yes | Active | 5 V | BCDMOS | 4 Mbps | MODEM | 1 | INDUSTRIAL | R-PDSO-G28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | HTSSOP | TSSOP28,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | DUAL | 4.4 mm | 9.7 mm | 1.2 mm | STMICROELECTRONICS | SSOP | LEAD FREE, HTSSOP-28 | 28 | compliant | 8542.39.00.01 | STMicroelectronics | EAR99 | |||||||
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AMIS30585C5852G
onsemi
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$14.9952 | Yes | Yes | Obsolete | MODEM | NOT SPECIFIED | NOT SPECIFIED | ONSEMI | 28 | 776AA | compliant | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||
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CYG2020
IXYS Corporation
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$15.2171 | No | No | Obsolete | 5 V | HYBRID | MODEM-SUPPORT CIRCUIT | 1 | 9 µA | COMMERCIAL | R-XDMA-P10 | e0 | Not Qualified | 70 °C | 10 | UNSPECIFIED | DIP | DIP18(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | TIN LEAD | PIN/PEG | DUAL | IXYS CORP | unknown | 8542.39.00.01 | |||||||||||||||||||
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CYG2011
IXYS Corporation
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$17.3036 | No | No | Obsolete | 5 V | HYBRID | MODEM-SUPPORT CIRCUIT | 1 | 9 µA | COMMERCIAL | R-XDMA-P9 | e0 | Not Qualified | 70 °C | 9 | UNSPECIFIED | DIP | DIP18(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | TIN LEAD | PIN/PEG | DUAL | IXYS CORP | unknown | 8542.39.00.01 | |||||||||||||||||||
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CPC5621ATR
IXYS Corporation
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$53.3890 | Yes | Yes | Transferred | 3.3 V | MODEM-SUPPORT CIRCUIT | IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY | 1 | 10 µA | INDUSTRIAL | R-PDSO-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | SSOP | SSOP32,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 635 µm | DUAL | 7.493 mm | 10.287 mm | 2.134 mm | IXYS CORP | SOIC | SOIC-32 | 32 | compliant | 8542.39.00.01 | ||||||||||
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SMV96AC-H1-D1-A0-P1
Conexant Systems Inc
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Check for Price | No | Obsolete | 5 V | 9 Mbps | MODEM-DATA/FAX/VOICE | 9.6 kbps | 1 | 82 mA | COMMERCIAL | R-XDMA-P63 | e0 | Not Qualified | 70 °C | 63 | UNSPECIFIED | DIP | DIP64(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | TIN LEAD | PIN/PEG | DUAL | CONEXANT SYSTEMS | DIP, DIP64(UNSPEC) | compliant | 8542.39.00.01 |