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1 - 10 of 26,042 results
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MCP2022PT-E/MD
Microchip Technology Inc
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Check for Price | Active | 12 V | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PDSO-N8 | 125 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 800 µm | DUAL | 4 mm | 4 mm | 1 mm | MICROCHIP TECHNOLOGY INC | DFN-8 | compliant | 8542.39.00.01 | ||||||||||||||||
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ATA6630-GLQW
Microchip Technology Inc
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$1.5900 | Yes | Yes | Not Recommended | 14 V | 1 | LIN TRANSCEIVER | 1 | 53 mA | AUTOMOTIVE | S-XQCC-N20 | e3 | 150 °C | -40 °C | AEC-Q100 | 20 | UNSPECIFIED | HVQCCN | LCC20,.2SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 900 µm | MICROCHIP TECHNOLOGY INC | 5 X 5 MM, LEAD FREE, VQFN-20 | compliant | 8542.39.00.01 | EAR99 | ||||||||
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UJA1065TW/3V3
NXP Semiconductors
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Check for Price | Yes | Obsolete | ETHERNET TRANSCEIVER | 1 | AUTOMOTIVE | R-PDSO-G32 | e3 | Not Qualified | 125 °C | -40 °C | 32 | PLASTIC/EPOXY | HTSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | TIN | GULL WING | 650 µm | DUAL | 6.1 mm | 11 mm | 1.1 mm | NXP SEMICONDUCTORS | HTSSOP, | unknown | 8542.39.00.01 | TSSOP | 32 | ||||||||||||
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PRLXT9785EBCD0
Intel Corporation
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Check for Price | Transferred | 2.5 V | INTERFACE CIRCUIT | 1 | COMMERCIAL | S-PBGA-B241 | Not Qualified | 70 °C | 241 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.57 mm | INTEL CORP | BGA, | unknown | 8542.39.00.01 | BGA | 241 | |||||||||||||||
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BU-63157F3-161L
Data Device Corporation
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Check for Price | Active | 5 V | 2 | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | R-PDFP-F36 | 125 °C | -55 °C | 36 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 2.54 mm | DUAL | 20.32 mm | 48.26 mm | 5.08 mm | DATA DEVICE CORP | FP-36 | compliant | 8542.39.00.01 | ||||||||||||||||
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RF9500
RF Micro Devices Inc
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Check for Price | Yes | Yes | Transferred | 2.7 V | BICMOS | ETHERNET TRANSCEIVER | 1 | 4.7 µA | OTHER | R-XQCC-N28 | Not Qualified | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | UNSPECIFIED | HQCCN | LCC28,.2X.27,25 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | YES | NO LEAD | 625 µm | QUAD | 5 mm | 6.8 mm | 1.015 mm | RF MICRO DEVICES INC | HQCCN, LCC28,.2X.27,25 | compliant | 8517.70.00.00 | 5A991.G | QFN | 28 | ||||||
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BU-67432G030L451K
Data Device Corporation
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Check for Price | Active | 5 V | 2 | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | S-CQFP-G36 | e0 | Not Qualified | 125 °C | -55 °C | MIL-PRF-38534 | 36 | CERAMIC, METAL-SEALED COFIRED | QFP | SQUARE | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | QUAD | 25.654 mm | 25.654 mm | 6.35 mm | DATA DEVICE CORP | QFP, | compliant | 8542.39.00.01 | ||||||||||||
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NHI-1540FP/M
Data Device Corporation
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Check for Price | Active | 5 V | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | R-XDFP-F36 | Not Qualified | 125 °C | -55 °C | 36 | UNSPECIFIED | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 2.54 mm | DUAL | 19.812 mm | 48.26 mm | 5.0038 mm | DATA DEVICE CORP | DFP-36 | compliant | 8542.39.00.01 | ||||||||||||||||
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5962-9688706HYX
Data Device Corporation
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Check for Price | Obsolete | 5 V | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | R-XDFP-F70 | Not Qualified | 125 °C | -55 °C | MIL-PRF-38534 Class H | 70 | UNSPECIFIED | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 1.27 mm | DUAL | 5.46 mm | DATA DEVICE CORP | DFP, | compliant | 8542.39.00.01 | DFP | 70 | |||||||||||||||
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BU-63147F4-480W
Data Device Corporation
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Check for Price | Active | 5 V | 2 | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | MILITARY | R-PDFP-F36 | 125 °C | -55 °C | 36 | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 2.54 mm | DUAL | 20.32 mm | 48.26 mm | 5.08 mm | DATA DEVICE CORP | DFP, | compliant | 8542.39.00.01 |