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11 - 20 of 45,096 results
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AP22800HB-7
Diodes Incorporated
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$0.2095 | Yes | End Of Life | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N8 | e4 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.6 mm | 2.1 mm | 605 µm | DIODES INC | 2.10 X 1.60 MM, GREEN, DFN-8 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | ||||||||||||||||||
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SL2S1512FTBX
NXP Semiconductors
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$0.2245 | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N3 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 3 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 550 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1122, XSON-3 | compliant | NXP | SON | 3 | SOT1122 | |||||||||||||||||
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SL3S1002FTB1,115
NXP Semiconductors
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$0.2245 | Yes | Obsolete | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PBCC-B3 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 3 | PLASTIC/EPOXY | BCC | LCC3(UNSPEC) | RECTANGULAR | CHIP CARRIER | YES | Tin (Sn) | BUTT | 550 µm | BOTTOM | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1122, SON-3 | compliant | NXP | SON | 3 | SOT1122 | |||||||||||||
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HTMS8001FTB/AF,115
NXP Semiconductors
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$0.2269 | Yes | Active | CMOS | TELECOM CIRCUIT | Not Qualified | 1 | 260 | NOT SPECIFIED | 3 | PLASTIC/EPOXY | QCCN | LCC3(UNSPEC) | CHIP CARRIER | YES | NO LEAD | QUAD | NXP SEMICONDUCTORS | compliant | NXP | SON | 3 | SOT1122 | ||||||||||||||||||||||||||
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AT88SC0808CRF-MR1
Microchip Technology Inc
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$0.2354 | Yes | Not Recommended | CMOS | SYNCHRONOUS | 1 | e4 | 70 °C | UNSPECIFIED | RECTANGULAR | Nickel/Gold (Ni/Au) | MICROCHIP TECHNOLOGY INC | GREEN PACKAGE-2 | compliant | 5A992.C | 8523.52.00.90 | Microchip | 8.192 kbit | CRYPTORF MEMORY | 8 | 1.024 k | 1000 | 1KX8 | ||||||||||||||||||||||||||
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AP22804BM8-13
Diodes Incorporated
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$0.2382 | Yes | Yes | Active | TELECOM CIRCUIT | e3 | 260 | 30 | MATTE TIN | DIODES INC | , | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | ||||||||||||||||||||||||||||||||||
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AP22804AW5-7
Diodes Incorporated
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$0.2453 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G5 | e3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25,5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | ||||||||||||||||
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AP22811BW5-7
Diodes Incorporated
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$0.2461 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G5 | e3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT25, 5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | |||||||||||||||||
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SL2S2002FTB,115
NXP Semiconductors
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$0.2570 | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N3 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 3 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 550 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-1122, XSON-3 | compliant | NXP | SON | 3 | SOT1122 | |||||||||||||||
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AP22804BW5-7
Diodes Incorporated
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$0.2595 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G5 | e3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25,5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated |