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VSC8102QB
Vitesse Semiconductor Corporation
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Check for Price | No | No | Transferred | 2 V | GAAS | TELECOM CIRCUIT | 8 | 1.43 mA | COMMERCIAL | R-PQFP-G100 | e0 | Not Qualified | 70 °C | 100 | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 3.4 mm | VITESSE SEMICONDUCTOR CORP | QFP | QFP, QFP100,.7X.9 | 100 | compliant | 8542.39.00.01 | |||||||||||||
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STLC60844
STMicroelectronics
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Check for Price | Obsolete | 3.3 V | BICMOS | TELECOM CIRCUIT | 8 | S-PBGA-B196 | Not Qualified | 196 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | STMICROELECTRONICS | BGA | BGA, | 196 | compliant | 8542.39.00.01 | |||||||||||||||||||||||||
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VSC8102QB
Microsemi Corporation
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Check for Price | No | Obsolete | 2 V | GAAS | TELECOM CIRCUIT | 8 | 1.43 A | COMMERCIAL | R-PQFP-G100 | e0 | Not Qualified | 70 °C | 100 | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 3.4 mm | MICROSEMI CORP | QFP, QFP100,.7X.9 | not_compliant | 8542.39.00.01 | ||||||||||||||||
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AVSP-8801-002
Broadcom Limited
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Check for Price | Active | 1 V | CMOS | 28 Tbps | TELECOM CIRCUIT | ALSO AVAILABLE WITH 2.5V NOMINAL SUPPLY | 8 | R-PBGA-B169 | 125 °C | 169 | PLASTIC/EPOXY | BGA | BGA169(UNSPEC) | RECTANGULAR | GRID ARRAY | YES | BALL | BOTTOM | BROADCOM INC | BGA-169 | compliant | |||||||||||||||||||||||||
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ADRV9026BBCZ-REEL
Analog Devices Inc
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Check for Price | No | Yes | Active | 1 V | TELECOM CIRCUIT | ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE | 4 | INDUSTRIAL | S-PBGA-B289 | e1 | 3 | 110 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 14 mm | 14 mm | 1.46 mm | ANALOG DEVICES INC | 289 | compliant | 8542.39.00.01 | BC-289-6 | 5A991.B | 2019-11-14 | Analog Devices | |||||||||
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RF3744
RF Micro Devices Inc
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Check for Price | No | No | Transferred | 3.3 V | BIPOLAR | TELECOM CIRCUIT | 4 | INDUSTRIAL | S-XUUC-N40 | Not Qualified | 1 | 85 °C | -40 °C | 40 | UNSPECIFIED | DIE | DIE OR CHIP | SQUARE | UNCASED CHIP | YES | NO LEAD | UPPER | RF MICRO DEVICES INC | DIE | DIE, DIE OR CHIP | 40 | compliant | 8542.39.00.01 | ||||||||||||||||||
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ISL32179EIRZ
Intersil Corporation
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Check for Price | Unknown | 3.3 V | BICMOS | TELECOM CIRCUIT | 4 | INDUSTRIAL | S-PQCC-N24 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | INTERSIL CORP | QFN | HVQCCN, | 24 | compliant | 8542.39.00.01 | EAR99 | ||||||||||||
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VSC7216-01
Microsemi Corporation
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Check for Price | Transferred | 3.3 V | TELECOM CIRCUIT | 4 | OTHER | S-PBGA-B256 | Not Qualified | 95 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | MICROSEMI CORP | BGA, | compliant | 8542.39.00.01 | |||||||||||||||||||||||
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SI3453A-B01-GMR
Silicon Laboratories Inc
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Check for Price | Yes | Obsolete | 3.3 V | TELECOM CIRCUIT | -48 V | 4 | INDUSTRIAL | S-XQCC-N40 | Not Qualified | 85 °C | -40 °C | 40 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | YES | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | SILICON LABORATORIES INC | QFN | HVQCCN, | 40 | unknown | 8542.39.00.01 | |||||||||||||||||
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SI3453-B01-GMR
Silicon Laboratories Inc
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Check for Price | Yes | Obsolete | 3.3 V | TELECOM CIRCUIT | -48 V | 4 | INDUSTRIAL | S-XQCC-N40 | Not Qualified | 85 °C | -40 °C | 40 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER | YES | NO LEAD | 500 µm | QUAD | 6 mm | 6 mm | 900 µm | SILICON LABORATORIES INC | QFN | HVQCCN, | 40 | unknown | 8542.39.00.01 |