Parametric results for: ISG211-031 under Other Telecom ICs

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AP22802AW5-7
Diodes Incorporated
$0.1269 Yes Not Recommended 5 V 1 LOAD SWITCH 1 R-PDSO-G5 1 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP TSOP5/6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT-25, 5 PIN compliant EAR99 8542.39.00.01 Diodes Incorporated NO 5.5 V 2.7 V
BGS12SN6E6327XTSA1
Infineon Technologies AG
$0.1316 Yes Obsolete 2.6 V TELECOM CIRCUIT 1 OTHER R-XBCC-B6 e3 1 85 °C -30 °C NOT SPECIFIED NOT SPECIFIED 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES Tin (Sn) BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG 1.10 X 0.70 MM, 0.31 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TSNP-6 compliant Infineon
AP22802BW5-7
Diodes Incorporated
$0.1561 Yes Not Recommended 5 V 1 LOAD SWITCH 1 R-PDSO-G5 85 °C -40 °C 260 5 PLASTIC/EPOXY LSSOP TSOP5/6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT-25, 5 PIN compliant EAR99 8542.39.00.01 Diodes Incorporated NO 5.5 V 2.7 V
AP22814BSN-7
Diodes Incorporated
$0.1653 Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL S-PDSO-N6 e4 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 650 µm DUAL 2 mm 2 mm 630 µm DIODES INC UDFN-6 compliant EAR99 8542.39.00.01 Diodes Incorporated
HTMS8001FTB/AF,115
NXP Semiconductors
$0.1716 Yes Active CMOS TELECOM CIRCUIT Not Qualified 1 260 NOT SPECIFIED 3 PLASTIC/EPOXY QCCN LCC3(UNSPEC) CHIP CARRIER YES NO LEAD QUAD NXP SEMICONDUCTORS compliant NXP SON 3 SOT1122
AP22811AM8-13
Diodes Incorporated
$0.1831 Yes Not Recommended 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G8 e3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 2.95 mm 3 mm 1.1 mm DIODES INC MSOP-8 compliant EAR99 8542.39.00.01 Diodes Incorporated
AP22804AM8-13
Diodes Incorporated
$0.2013 Yes Active 5 V TELECOM CIRCUIT 1 S-PDSO-G8 e3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 3 mm 3 mm 1.1 mm DIODES INC , compliant EAR99 8542.39.00.01 Diodes Incorporated
AP22800HB-7
Diodes Incorporated
$0.2080 Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N8 e4 85 °C -40 °C 260 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.6 mm 2.1 mm 605 µm DIODES INC 2.10 X 1.60 MM, GREEN, DFN-8 compliant EAR99 8542.39.00.01 Diodes Incorporated
AP22804AW5-7
Diodes Incorporated
$0.2105 Yes Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G5 e3 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT-25,5 PIN compliant EAR99 8542.39.00.01 Diodes Incorporated
SL3S1013FTB0,115
NXP Semiconductors
$0.2155 Yes Active CMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N6 1 85 °C -40 °C 260 NOT SPECIFIED 6 PLASTIC/EPOXY VSON RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE YES NO LEAD 500 µm DUAL 1 mm 1.45 mm 500 µm NXP SEMICONDUCTORS 1.45 X 1 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT886F1, XSON-6 compliant 8542.32.00 NXP SON 6 SOT886