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21 - 30 of 678 results
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VMS113
NXP Semiconductors
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Check for Price | Obsolete | 5 V | CMOS | DATA ENCRYPTION CIRCUIT | 1 | COMMERCIAL | S-PQCC-J44 | e0 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44(UNSPEC) | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | QUAD | NXP SEMICONDUCTORS | LCC | QCCJ, LDCC44(UNSPEC) | 44 | unknown | 8542.39.00.01 | ||||||||||||||||
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AM9568DC
Rochester Electronics LLC
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Check for Price | No | No | Active | 5 V | DATA ENCRYPTION CIRCUIT | 1 | COMMERCIAL | R-GDIP-T40 | e0 | COMMERCIAL | NOT SPECIFIED | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 40 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | ROCHESTER ELECTRONICS LLC | DIP | HERMETIC SEALED, CERDIP-40 | 40 | unknown | ||||||||||||||
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HCS300/SNA21
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 5 V | DATA ENCRYPTION CIRCUIT | 1 | 2.5 mA | COMMERCIAL | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9116 mm | 4.9 mm | 1.75 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 8542.39.00.01 | ||||||||||
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AM9568LIB
AMD
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Check for Price | Obsolete | 5 V | MOS | DATA ENCRYPTION CIRCUIT | 1 | 250 mA | INDUSTRIAL | S-CQCC-N48 | Not Qualified | 85 °C | -40 °C | 48 | CERAMIC, METAL-SEALED COFIRED | QCCN | SQUARE | CHIP CARRIER | YES | NO LEAD | QUAD | ADVANCED MICRO DEVICES INC | LCC | QCCN, | 48 | unknown | 8542.39.00.01 | |||||||||||||||||
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MC6859CLDS
Motorola Semiconductor Products
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Check for Price | No | Obsolete | 5 V | NMOS | DATA ENCRYPTION CIRCUIT | 1 | INDUSTRIAL | R-CDIP-T24 | e0 | Not Qualified | 85 °C | -40 °C | 24 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA INC | DIP, DIP24,.6 | unknown | 8542.39.00.01 | |||||||||||||||
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HCS300-I/SNVAO
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 5 V | DATA ENCRYPTION CIRCUIT | 1 | 2.5 mA | INDUSTRIAL | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 8542.31.00.01 | EAR99 | ||||
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HCS512T/SN
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 5 V | CMOS | DATA ENCRYPTION CIRCUIT | 1 | 10 mA | COMMERCIAL | R-PDSO-G18 | e3 | Not Qualified | 1 | 70 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.300 INCH, PLASTIC, SOIC-18 | 18 | compliant | 8542.39.00.01 | ||||||||
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MC68A59CLDS
Motorola Mobility LLC
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Check for Price | Obsolete | 5 V | NMOS | DATA ENCRYPTION CIRCUIT | 1 | INDUSTRIAL | R-CDIP-T24 | e0 | Not Qualified | 85 °C | -40 °C | 24 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA INC | DIP | DIP, DIP24,.6 | 24 | unknown | 8542.39.00.01 | ||||||||||||||
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HCS412-/SN
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 3 V | DATA ENCRYPTION CIRCUIT | 1 | COMMERCIAL | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | DUAL | MICROCHIP TECHNOLOGY INC | SOIC | SOP, | 8 | compliant | ||||||||||||||
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HCS509-I/P
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 4.5 V | DATA ENCRYPTION CIRCUIT | 1 | 10 mA | INDUSTRIAL | R-PDIP-T18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.8 mm | 4.32 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, PLASTIC, DIP-18 | 18 | compliant | 8542.39.00.01 |