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Parametric results for: Telecom Switching Circuits

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S3054TTI
 Applied Micro Circuits Corporation 		Check for Price Obsolete 3.3 V DIGITAL TIME SWITCH 2 330 mA INDUSTRIAL S-PQFP-G52 Not Qualified 85 °C -40 °C 52 PLASTIC/EPOXY HLQFP QFP52,.47SQ SQUARE FLATPACK, HEAT SINK/SLUG, LOW PROFILE YES GULL WING 650 µm QUAD 10 mm 10 mm 1.6 mm APPLIED MICRO CIRCUITS CORP QFP HLQFP, QFP52,.47SQ 52 unknown 8542.39.00.01
S3054TT
 Applied Micro Circuits Corporation 		Check for Price Obsolete 3.3 V DIGITAL TIME SWITCH 2 S-PQFP-G52 Not Qualified 52 PLASTIC/EPOXY HLQFP SQUARE FLATPACK, HEAT SINK/SLUG, LOW PROFILE YES GULL WING 650 µm QUAD 10 mm 10 mm 1.6 mm APPLIED MICRO CIRCUITS CORP QFP HLQFP, 52 unknown 8542.39.00.01
S3054
 Applied Micro Circuits Corporation 		Check for Price Obsolete 3.3 V DIGITAL TIME SWITCH 2 S-PQFP-G52 Not Qualified 52 PLASTIC/EPOXY HQFP SQUARE FLATPACK, HEAT SINK/SLUG YES GULL WING 650 µm QUAD 10 mm 10 mm APPLIED MICRO CIRCUITS CORP QFP HQFP, 52 unknown 8542.39.00.01
IDT72V70820PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 3.3 V DIGITAL TIME SWITCH 1 INDUSTRIAL S-PQFP-G100 e3 Not Qualified 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LFQFP, 100 compliant 8542.39.00.01
PEF24471
 Lantiq 		Check for Price Transferred 3.3 V CMOS DIGITAL TIME SWITCH 1 INDUSTRIAL S-PBGA-B217 Not Qualified 85 °C -40 °C 217 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL 1.27 mm BOTTOM 23 mm 23 mm 2.35 mm LANTIQ BGA BGA, 217 unknown 8542.39.00.01
USW-PRO-24
 Ubiquiti Networks Inc 		Check for Price Contact Manufacturer ETHERNET SWITCH device also having USP RPS DC Input 11.5... more 1 R-XXMA-X 45 °C -5 °C UNSPECIFIED XMA RECTANGULAR MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED UBIQUITI NETWORKS INC PACKAGE unknown
ZL50011/GDC
 Microsemi Corporation 		Check for Price No No Obsolete 3.3 V DIGITAL TIME SWITCH 1 250 mA INDUSTRIAL S-PBGA-B144 e0 Not Qualified 85 °C -40 °C 144 PLASTIC/EPOXY LBGA BGA144,12X12,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 13 mm 13 mm 1.25 mm MICROSEMI CORP BGA 13 X 13 MM, 1.25 MM HEIGHT, MO-192, LBGA-144 144 unknown 8542.39.00.01
IDT72V70180TF9
 Integrated Device Technology Inc 		Check for Price Obsolete 3.3 V DIGITAL TIME SWITCH 1 INDUSTRIAL S-PQFP-G64 e0 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 10 mm 10 mm 1.6 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LFQFP, 64 unknown 8542.39.00.01
72V70180PFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 3.3 V DIGITAL TIME SWITCH 1 INDUSTRIAL S-PQFP-G64 e3 Not Qualified 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES TIN GULL WING 800 µm QUAD 14 mm 14 mm 1.6 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP PLASTIC, TQFP-64 64 compliant 8542.39.00.01 PNG64
IDT7290820BCG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 5 V DIGITAL TIME SWITCH 1 INDUSTRIAL S-PBGA-B100 e1 Not Qualified 3 85 °C -40 °C 100 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 11 mm 11 mm 1.5 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 11 X 11 MM, 1 MM PITCH, BGA-100 100 compliant 8542.39.00.01
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