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11 - 20 of 4,162 results
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MC34013APS
Motorola Semiconductor Products
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Check for Price | No | Obsolete | BIPOLAR | COMMERCIAL | R-PDIP-T28 | e0 | Not Qualified | 60 °C | -20 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA INC | DIP, DIP28,.6 | unknown | 8542.39.00.01 | |||||||||||||||
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ICS1660NLF
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 5 V | CMOS | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | 1 | COMMERCIAL | R-PDIP-T18 | e3 | Not Qualified | 70 °C | 18 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 22.86 mm | 5.33 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP, | compliant | 8542.39.00.01 | DIP | 18 | ||||||||
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935260608112
NXP Semiconductors
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Check for Price | Obsolete | 3.6 V | TELEPHONE MULTIFUNCTION CIRCUIT | 2:3 | 1 | COMMERCIAL EXTENDED | R-PDSO-G28 | Not Qualified | 75 °C | -25 °C | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 17.9 mm | 2.65 mm | NXP SEMICONDUCTORS | SOP, | unknown | 8542.39.00.01 | SOIC | 28 | |||||||||||
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TEA1064AT/C2
NXP Semiconductors
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Check for Price | Obsolete | 2.8 V | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G20 | Not Qualified | 75 °C | -25 °C | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | NXP SEMICONDUCTORS | SOP, | unknown | 8542.39.00.01 | SOIC | 20 | |||||||||||
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HT9302D(24SKDIP-A)
Holtek Semiconductor Inc
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Check for Price | Obsolete | HOLTEK SEMICONDUCTOR INC | unknown | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||
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HT9312FCT
Holtek Semiconductor Inc
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Check for Price | No | Obsolete | CMOS | 3.58 MHz | 2 mA | COMMERCIAL | R-PDIP-T22 | e0 | Not Qualified | 70 °C | -20 °C | 22 | PLASTIC/EPOXY | DIP | DIP22(UNSPEC) | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | DUAL | HOLTEK SEMICONDUCTOR INC | DIP, DIP22(UNSPEC) | unknown | 8542.39.00.01 | ||||||||||||||
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WE9187
Winbond Electronics Corp
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Check for Price | No | Obsolete | CMOS | 3.58 MHz | 15 mA | OTHER | R-PDIP-T16 | e0 | Not Qualified | 60 °C | -30 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WINBOND ELECTRONICS CORP | not_compliant | 8542.39.00.01 | ||||||||||||||
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W91448
Winbond Electronics Corp
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Check for Price | No | Obsolete | 2.5 V | CMOS | 3.58 MHz | REPERTORY | 1 µA | COMMERCIAL | R-PDIP-T18 | e0 | Not Qualified | 70 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | WINBOND ELECTRONICS CORP | not_compliant | 8542.39.00.01 | |||||||||||||
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MX602P
CML Microcircuits Plc
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Check for Price | Obsolete | 5 V | CMOS | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | 1 | 2 µA | INDUSTRIAL | R-PDIP-T16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.685 mm | 5.06 mm | CML MICROCIRCUITS LTD | DIP, DIP16,.3 | unknown | 8542.39.00.01 | DIP | 16 | |||||||||
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TEA1098A
Unisonic Technologies Co Ltd
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Check for Price | Active | BIPOLAR | SPEAKER PHONE CIRCUIT | OTHER | R-PDSO-G40 | Not Qualified | 70 °C | -25 °C | 40 | PLASTIC/EPOXY | SSOP | SOP40,.5,30 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 750 µm | DUAL | UNISONIC TECHNOLOGIES CO LTD | compliant | 8542.39.00.01 |