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CGA1A2C0G1E050C030BA
TDK Corporation
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$0.0178 | Yes | Yes | Active | 5 pF | 25 V | 5 % | 0201 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 300 µm | 600 µm | 300 µm | TDK CORP | , 0201 | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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CGA1A2C0G1H050C030BA
TDK Corporation
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$0.0197 | Yes | Yes | Active | 5 pF | 50 V | 5 % | 0201 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 300 µm | 600 µm | 300 µm | TDK CORP | , 0201 | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C1005NP01H050C050BA
TDK Corporation
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$0.0201 | Yes | Yes | Active | 5 pF | 50 V | 5 % | 0402 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 150 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | , 0402 | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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CGA2B2NP01H050C050BA
TDK Corporation
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$0.0211 | Yes | Yes | Active | 5 pF | 50 V | 5 % | 0402 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 150 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PUNCHED PAPER, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | , 0402 | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C1608C0G1H050C080AA
TDK Corporation
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$0.0211 | Yes | Yes | Not Recommended | 5 pF | 50 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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CL21C050CBANNNC
Samsung Electro-Mechanics
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$0.0265 | Yes | Yes | Active | 5 pF | 50 V | 5 % | 0805 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | TR, CARDBOARD, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | SAMSUNG ELECTRO-MECHANICS | CHIP | compliant | EAR99 | 8532.24.00.20 | 0805 | ||||||||
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C1608C0G2A050C080AA
TDK Corporation
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$0.0312 | Yes | Yes | Active | 5 pF | 100 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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C1608NP01H050C080AA
TDK Corporation
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$0.0317 | Yes | Yes | Active | 5 pF | 50 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 150 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 | TDK | ||||
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CGA3E2C0G2A050C080AA
TDK Corporation
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$0.0322 | Yes | Yes | Active | 5 pF | 100 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C1608NP02A050C080AA
TDK Corporation
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$0.0381 | Yes | Yes | Active | 5 pF | 100 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 150 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 | TDK |