Parametric results for: 131g under ATM/SONET/SDH ICs
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ZL30131GGG2
Microchip Technology Inc
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$96.9795 | Yes | Active | 1.8 V | ATM/SONET/SDH NETWORK INTERFACE | SDH; SONET | 1 | 188 mA | INDUSTRIAL | S-PBGA-B100 | e1 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | FBGA | BGA100,10X10,32 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.72 mm | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||||||
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FX-424-DFF-D131G
Microsemi Corporation
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Check for Price | Yes | Transferred | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N13 | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 13 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | GOLD OVER NICKEL | NO LEAD | 2.54 mm | DUAL | 13.716 mm | 20.32 mm | 5.08 mm | MICROSEMI CORP | compliant | PACKAGE-14/13 | 8542.39.00.01 | |||||||||||||||||
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FX-424-DAF-A131G
Microsemi Corporation
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Check for Price | Yes | Transferred | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N13 | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 13 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | GOLD OVER NICKEL | NO LEAD | 2.54 mm | DUAL | 13.716 mm | 20.32 mm | 5.08 mm | MICROSEMI CORP | compliant | PACKAGE-14/13 | 8542.39.00.01 | |||||||||||||||||
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ZL30131GGG2
Zarlink Semiconductor Inc
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Check for Price | Transferred | 1.8 V | ATM/SONET/SDH SUPPORT CIRCUIT | SONET;SDH | 1 | INDUSTRIAL | S-PBGA-B100 | e1 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.72 mm | ZARLINK SEMICONDUCTOR INC | unknown | 9 X 9 MM, 0.80 MM PITCH, LEAD FREE, CABGA-100 | 8542.39.00.01 | |||||||||||||||||||
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FX-424-DFC-D131G
Microsemi Corporation
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Check for Price | Yes | Transferred | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | COMMERCIAL | R-PDSO-N13 | e4 | 1 | 70 °C | 260 | 40 | 13 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | GOLD OVER NICKEL | NO LEAD | 2.54 mm | DUAL | 13.716 mm | 20.32 mm | 5.08 mm | MICROSEMI CORP | compliant | PACKAGE-14/13 | 8542.39.00.01 | ||||||||||||||||||
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ZL30131GGG
Microsemi Corporation
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Check for Price | Obsolete | 1.8 V | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B100 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.72 mm | MICROSEMI CORP | compliant | 9 X 9 MM, 0.80 MM PITCH, CABGA-100 | 8542.39.00.01 | BGA | 100 | ||||||||||||||||||||
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131G23C
Zhongshan Silsmart Optoelectronics Co Ltd
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Check for Price | Yes | Contact Manufacturer | 85 °C | -40 °C | ZHONGSHAN SILSMART OPTOELECTRONICS CO LTD | unknown | 8541.40.20.00 | Blue-Green | 40 mA | 4 V | WATER CLEAR | 525 nm | 5 V | 30 deg | |||||||||||||||||||||||||||||||||
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ZL30131GGG2
Microsemi Corporation
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Check for Price | Yes | Transferred | 1.8 V | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | INDUSTRIAL | S-PBGA-B100 | e1 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.72 mm | MICROSEMI CORP | compliant | 9 X 9 MM, 0.80 MM PITCH, LEAD FREE, CABGA-100 | 8542.39.00.01 | BGA | 100 | Microsemi Corporation | ||||||||||||||||
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GD16131-GLP
Intel Corporation
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Check for Price | Active | BIPOLAR | S-XQFP-G68 | Not Qualified | 68 | CERAMIC | QFP | QFP68,.85SQ,40 | SQUARE | FLATPACK | YES | GULL WING | 1 mm | QUAD | INTEL CORP | compliant | QFP, QFP68,.85SQ,40 | 8542.39.00.01 | |||||||||||||||||||||||||||||
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FX-424-DAC-A131G
Microsemi Corporation
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Check for Price | Yes | Transferred | 3.3 V | ATM/SONET/SDH SUPPORT CIRCUIT | 1 | COMMERCIAL | R-PDSO-N13 | e4 | 1 | 70 °C | 260 | 40 | 13 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | GOLD OVER NICKEL | NO LEAD | 2.54 mm | DUAL | 13.716 mm | 20.32 mm | 5.08 mm | MICROSEMI CORP | compliant | PACKAGE-14/13 | 8542.39.00.01 |