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1 - 10 of 174 results
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JAN1N4104C-1
Microsemi Corporation
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$9.6163 | No | No | Transferred | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | DO-7, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||
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JAN1N4104C-1
Microchip Technology Inc
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$10.8204 | No | Active | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant | |||||||||||
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JANTX1N4104C-1
Microchip Technology Inc
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$12.5522 | No | Active | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 2 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant | |||||||||
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JANTX1N4104C-1
Microsemi Corporation
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$13.2940 | No | No | Transferred | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 2 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | DO-7, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | ||||
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JAN1N4104CUR-1
Microchip Technology Inc
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$15.0062 | No | Active | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LELF-R2 | e0 | MIL-19500/435F | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AA, 2 PIN | compliant | ||||||||
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JAN1N4104CUR-1
Microsemi Corporation
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$19.2372 | No | Transferred | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/435F | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA, 2 PIN | unknown | ||||||||
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JANTXV1N4104C-1
Microsemi Corporation
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$21.0772 | No | No | Transferred | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 2 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | DO-7, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | ||||
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JANTX1N4104CUR-1
Microsemi Corporation
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$22.1311 | No | Transferred | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/435F | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA, 2 PIN | unknown | ||||||||||
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JANTX1N4104CUR-1/TR
Microchip Technology Inc
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$23.8118 | Active | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LELF-R2 | e0 | MIL-19500/435F | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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JANTXV1N4104C-1
Microchip Technology Inc
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$23.8568 | No | Active | 250 µA | 500 mW | 10 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 2 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant |