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1N6635US
Microchip Technology Inc
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$15.0062 | No | Active | 290 mA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY | 5 % | Not Qualified | R-LUFM-D2 | e0 | ISOLATED | 2 | GLASS | RECTANGULAR | FLANGE MOUNT | TIN LEAD | SOLDER LUG | UPPER | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||||||
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JAN1N6635US
Microsemi Corporation
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Check for Price | No | Obsolete | 290 mA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROSEMI CORP | unknown | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | EAR99 | 8541.10.00.50 | |||||||||||
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JANS1N6635US
Microchip Technology Inc
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Check for Price | No | Active | 290 mA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||||||
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JANTXV1N6635US/TR
Microchip Technology Inc
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Check for Price | Active | 290 mA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||
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JANTX1N6635US
Compensated Devices Inc
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Check for Price | Transferred | 290 mA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | MIL-19500/356H | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | COMPENSATED DEVICES INC | unknown | HERMETIC SEALED, GLASS PACKAGE-2 | ||||||||||||||
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JAN1N6635US/TR
Microchip Technology Inc
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Check for Price | Active | 290 mA | 25 µA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 2 Ω | 500 Ω | 1 V | 2.15 mV/°C | 5 % | O-LELF-R2 | MIL-PRF-19500; MIL-STD-750 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | |||||||||||
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JANS1N6635US
Microsemi Corporation
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Check for Price | No | Transferred | 290 mA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROSEMI CORP | unknown | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | EAR99 | 8541.10.00.50 | |||||||||||
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JAN1N6635US
Defense Logistics Agency
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Check for Price | Active | 290 mA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | unknown | HERMETIC SEALED, GLASS PACKAGE-2 | |||||||||||||||||
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1N6635US
Microsemi Corporation
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Check for Price | No | No | Transferred | 290 mA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY | 5 % | Not Qualified | R-LUFM-D2 | e0 | ISOLATED | 2 | GLASS | RECTANGULAR | FLANGE MOUNT | TIN LEAD | SOLDER LUG | UPPER | MICROSEMI CORP | unknown | HERMETIC SEALED, GLASS, D58, 2 PIN | 2 | EAR99 | 8541.10.00.50 | ||||||||||
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JAN1N6635US
Microchip Technology Inc
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Check for Price | Active | 290 mA | 25 µA | 5 W | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 2 Ω | 500 Ω | 1 V | 2.15 mV/°C | 5 % | O-LELF-R2 | MIL-PRF-19500; MIL-STD-750 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8541.10.00.50 |