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MAX2990ECB+
Analog Devices Inc
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Check for Price | Yes | Not Recommended | 1.8 V | CMOS | 400 Mbps | MODEM | 1 | 80 mA | S-PQFP-G64 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.6 mm | 64-LQFP-10X10X1.4 | 64 | 64-LQFP-10X10X1.4 | 2008-05-22 | Analog Devices | |||||||||
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CX86810-21
Conexant Systems Inc
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Check for Price | Transferred | 1.8 V | 9.6 Gbps | MODEM-FAX | 1 | COMMERCIAL | R-XQFP-G100 | Not Qualified | 70 °C | 100 | UNSPECIFIED | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 1.6 mm | QFP | 100 | CONEXANT SYSTEMS | LQFP, | compliant | 8542.39.00.01 | ||||||||||||||||
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S5N8952X
Samsung Semiconductor
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Check for Price | Obsolete | 1.8 V | CMOS | 8 Gbps | MODEM | 1 | COMMERCIAL | S-PQFP-G208 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | LFQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 28 mm | 28 mm | 1.6 mm | QFP | 208 | SAMSUNG SEMICONDUCTOR INC | LFQFP, QFP208,1.2SQ,20 | compliant | 8542.39.00.01 | ||||||||||||||
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CX86810-12
Synaptics Incorporated
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Check for Price | Active | 1.8 V | 1.2 Gbps | MODEM-FAX | 1 | COMMERCIAL | R-XQFP-G100 | Not Qualified | 70 °C | 100 | UNSPECIFIED | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 1.6 mm | SYNAPTICS INC | LQFP, | compliant | 8542.39.00.01 | ||||||||||||||||||
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CX86810-22
Conexant Systems Inc
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Check for Price | Transferred | 1.8 V | 1.2 Gbps | MODEM-FAX | 1 | COMMERCIAL | R-XQFP-G100 | Not Qualified | 70 °C | 100 | UNSPECIFIED | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 1.6 mm | QFP | 100 | CONEXANT SYSTEMS | LQFP, | compliant | 8542.39.00.01 | ||||||||||||||||
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CMX7163Q1
CML Microcircuits Plc
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Check for Price | Active | 1.8 V | MODEM | 1 | INDUSTRIAL | S-XQCC-N64 | Not Qualified | 85 °C | -40 °C | 64 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 9 mm | 9 mm | 1 mm | QFN | 64 | CML MICROCIRCUITS LTD | VQFN-64 | compliant | 8542.39.00.01 | ||||||||||||||||
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CX86810-12
Conexant Systems Inc
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Check for Price | Transferred | 1.8 V | 1.2 Gbps | MODEM-FAX | 1 | COMMERCIAL | R-XQFP-G100 | Not Qualified | 70 °C | 100 | UNSPECIFIED | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 1.6 mm | QFP | 100 | CONEXANT SYSTEMS | LQFP, | compliant | 8542.39.00.01 | ||||||||||||||||
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IT9517FN-I/AX
Integrated Technology Express Inc
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Check for Price | Yes | Contact Manufacturer | 1.2 V | 31.6 Gbps | MODEM-MODULATOR | ALSO REQUIRES 3.3 V SUPPLY | 1 | INDUSTRIAL | S-XQCC-N64 | 85 °C | -40 °C | 64 | UNSPECIFIED | HVQCCN | LCC64,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 8 mm | 8 mm | 900 µm | ITE TECH INC | MQFN-64 | unknown | ||||||||||||||||
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CX86810-11
Conexant Systems Inc
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Check for Price | Transferred | 1.8 V | 9.6 Gbps | MODEM-FAX | 1 | COMMERCIAL | R-XQFP-G100 | Not Qualified | 70 °C | 100 | UNSPECIFIED | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 14 mm | 20 mm | 1.6 mm | QFP | 100 | CONEXANT SYSTEMS | LQFP, | compliant | 8542.39.00.01 | ||||||||||||||||
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MAX2990ECB+T
Maxim Integrated Products
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Check for Price | Yes | Transferred | 1.8 V | CMOS | 400 Mbps | MODEM | 1 | 80 mA | S-PQFP-G64 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | , | compliant | 8542.39.00.01 |