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Parametric » Logic » Other Logic ICs

Parametric results for: 74LVC1G98GW under Other Logic ICs

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Select Parts		Part Number

		74LVC1G98GW,125 Nexperia
		74LVC1G98GW Nexperia
		74LVC1G98GW NXP Semiconductors
		74LVC1G98GW,125 NXP Semiconductors

			Most Relevant					Technical					Compliance			Operating Conditions					Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Number of Functions	Surface Mount	Package Code	Family	Logic IC Type	Technology	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	Samacsys Manufacturer	HTS Code

Yes

Active

2.3 V

1

YES

TSSOP

LVC/LCX/Z

LOGIC CIRCUIT

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

e3

1

125 °C

-40 °C

260

30

6

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP

SOT-363, 6 PIN

6

SOT363-2

compliant

Nexperia

Check for Price

Yes

Active

MAJORITY LOGIC GATE

AUTOMOTIVE

Not Qualified

e3

1

260

30

TIN

NEXPERIA

TSSOP,

compliant

8542.39.00.01

Check for Price

Yes

Transferred

2.3 V

1

YES

TSSOP

LVC/LCX/Z

LOGIC CIRCUIT

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

1

125 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

6

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Pure Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

SOT-363

PLASTIC, SOT-363, SC-88, PACKAGE-6

6

unknown

8542.39.00.01

Check for Price

Transferred

2.3 V

1

YES

TSSOP

LVC/LCX/Z

LOGIC CIRCUIT

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

e3

125 °C

-40 °C

6

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

TSSOP

PLASTIC, SOT-363, SC-88, PACKAGE-6

6

SOT363

unknown

Compare

74LVC1G98GW,125

Nexperia

Yes

Active

2.3 V

1

YES

TSSOP

LVC/LCX/Z

LOGIC CIRCUIT

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

e3

1

125 °C

-40 °C

260

30

6

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP

SOT-363, 6 PIN

6

SOT363-2

compliant

Nexperia

Nexperia

Check for Price

Yes

Active

MAJORITY LOGIC GATE

AUTOMOTIVE

Not Qualified

e3

1

260

30

TIN

NEXPERIA

TSSOP,

compliant

8542.39.00.01

NXP Semiconductors

Check for Price

Yes

Transferred

2.3 V

1

YES

TSSOP

LVC/LCX/Z

LOGIC CIRCUIT

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

1

125 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

6

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Pure Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

SOT-363

PLASTIC, SOT-363, SC-88, PACKAGE-6

6

unknown

8542.39.00.01

74LVC1G98GW,125

NXP Semiconductors

Check for Price

Transferred

2.3 V

1

YES

TSSOP

LVC/LCX/Z

LOGIC CIRCUIT

CMOS

5.5 V

1.65 V

AUTOMOTIVE

R-PDSO-G6

e3

125 °C

-40 °C

6

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

TSSOP

PLASTIC, SOT-363, SC-88, PACKAGE-6

6

SOT363

unknown