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74LVC2G07GV,125
Nexperia
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$0.1729 | Yes | Active | 1.8 V | 8.4 ns | 2 | 1 | YES | TSSOP | OPEN-DRAIN | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR, 7 INCH | TIN | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NEXPERIA | TSOP | PLASTIC, SC-74, SOT-457, TSOP-6 | 6 | SOT457 | compliant | 8542.39.00.01 | Nexperia | |||||||||||
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74LVC2G07GV-Q100
Nexperia
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Check for Price | Yes | Active | 3.3 V | 8.4 ns | 2 | 1 | YES | TSOP | 50 pF | YES | OPEN-DRAIN | LVC/LCX/Z | BUFFER | CMOS | 32 mA | 4 µA | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 6 | PLASTIC/EPOXY | TSOP6,.10,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | TIN | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NEXPERIA | TSSOP, | compliant | 8542.39.00.01 | |||||||||||
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74LVC2G07GV
NXP Semiconductors
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Check for Price | Yes | Yes | Transferred | 1.8 V | 8.4 ns | 4.7 ns | 2 | 1 | YES | TSSOP | 50 pF | NO | OPEN-COLLECTOR | LVC/LCX/Z | BUFFER | CMOS | 24 mA | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin (Sn) | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NXP SEMICONDUCTORS | TSOP | PLASTIC, SC-74, SOT-457, TSOP-6 | 6 | compliant | 8542.39.00.01 | EAR99 | |||||||
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74LVC2G07GV-Q100H
Nexperia
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Check for Price | Active | 3.3 V | 8.4 ns | 2 | 1 | YES | TSSOP | OPEN-DRAIN | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 30 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR, 7 INCH | TIN | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NEXPERIA | TSOP | TSSOP, | 6 | SOT457 | compliant | Nexperia | |||||||||||||
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74LVC2G07GV,125
NXP Semiconductors
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Check for Price | Yes | Transferred | 1.8 V | 8.4 ns | 4.7 ns | 2 | 1 | YES | TSSOP | 50 pF | NO | OPEN-DRAIN | LVC/LCX/Z | BUFFER | CMOS | 24 mA | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TR | Tin (Sn) | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NXP SEMICONDUCTORS | TSOP | PLASTIC, SC-74, SOT-457, TSOP-6 | 6 | SOT457 | compliant | 8542.39.00.01 | |||||||
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74LVC2G07GV-Q100H
NXP Semiconductors
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Check for Price | Transferred | 3.3 V | 8.4 ns | 2 | 1 | YES | TSSOP | OPEN-DRAIN | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | 125 °C | -40 °C | AEC-Q100 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NXP SEMICONDUCTORS | TSOP | TSSOP, | 6 | SOT457 | unknown | ||||||||||||||||||||
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74LVC2G07GV
Philips Semiconductors
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Check for Price | Yes | Transferred | 3.3 V | 4.7 ns | YES | TSOP | 50 pF | NO | OPEN-DRAIN | BUFFER | CMOS | 24 mA | AUTOMOTIVE | R-PDSO-G6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 6 | PLASTIC/EPOXY | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | TR | MATTE TIN | GULL WING | 950 µm | DUAL | PHILIPS SEMICONDUCTORS | unknown | 8542.39.00.01 | |||||||||||||||||||||
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74LVC2G07GV
Nexperia
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Check for Price | Yes | Active | 1.8 V | 8.4 ns | 2 | 1 | YES | TSOP | OPEN-DRAIN | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | TIN | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NEXPERIA | compliant | 8542.39.00.01 | Nexperia | ||||||||||||||||
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74LVC2G07GV-Q100
NXP Semiconductors
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Check for Price | Transferred | 3.3 V | 8.4 ns | 2 | 1 | YES | TSSOP | OPEN-DRAIN | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | 125 °C | -40 °C | AEC-Q100 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NXP SEMICONDUCTORS | TSOP | TSSOP, | 6 | unknown | 8542.39.00.01 | ||||||||||||||||||||
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74LVC2G07GV-Q100,125
NXP Semiconductors
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Check for Price | Active | 3.3 V | 8.4 ns | 2 | 1 | YES | TSOP | OPEN-DRAIN | LVC/LCX/Z | BUFFER | CMOS | 5.5 V | 1.65 V | AUTOMOTIVE | R-PDSO-G6 | 125 °C | -40 °C | AEC-Q100 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | GULL WING | 950 µm | DUAL | 1.1 mm | 1.5 mm | 2.9 mm | NXP SEMICONDUCTORS | TSOP, | unknown | 8542.39.00.01 |