Parametric results for: 8403611ja under SRAMs

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Manufacturer Part Number: 8403611ja
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8403611JA
Defense Logistics Agency
Check for Price Active 16.384 kbit 8 2KX8 5 V 55 ns STANDARD SRAM AUTOMATIC POWER-DOWN 1 2000 2.048 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Qualified 125 °C -55 °C MIL-STD-883 24 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.715 mm 31.9405 mm 15.24 mm DEFENSE LOGISTICS AGENCY CERAMIC, DIP-24 unknown
8403611JA
Integrated Device Technology Inc
Check for Price No No Transferred 16.384 kbit 8 2KX8 5 V 55 ns STANDARD SRAM COMMON 1 1 2000 2.048 k ASYNCHRONOUS 3-STATE YES PARALLEL 20 mA 4.5 V 120 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Qualified e0 1 125 °C -55 °C 240 MIL-STD-883 24 CERAMIC, GLASS-SEALED DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.826 mm 32.004 mm 15.24 mm INTEGRATED DEVICE TECHNOLOGY INC CERAMIC, DIP-24 not_compliant CDIP 24 CD24 3A001.A.2.C 8542.32.00.41 1989-01-01
8403611JA
Renesas Electronics Corporation
Check for Price No No Obsolete 16.384 kbit 8 2KX8 5 V 55 ns STANDARD SRAM COMMON 1 1 2000 2.048 k ASYNCHRONOUS 3-STATE YES PARALLEL 20 mA 4.5 V 120 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Qualified e0 1 125 °C -55 °C 240 MIL-STD-883 24 CERAMIC, GLASS-SEALED DIP DIP24,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.826 mm 32.004 mm 15.24 mm RENESAS ELECTRONICS CORP CERAMIC, DIP-24 not_compliant CDIP 24 CD24 3A001A2C 8542320041 Renesas Electronics
8403611JA
Cypress Semiconductor
Check for Price Obsolete 16.384 kbit 8 2KX8 5 V 55 ns STANDARD SRAM AUTOMATIC POWER-DOWN 1 1 2000 2.048 k ASYNCHRONOUS 3-STATE YES PARALLEL 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Not Qualified 125 °C -55 °C MIL-STD-883 24 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.715 mm 31.877 mm 15.24 mm CYPRESS SEMICONDUCTOR CORP CERAMIC, DIP-24 unknown DIP 24 3A001.A.2.C 8542.32.00.41
8403611JA
Pyramid Semiconductor Corporation
Check for Price Active 16.384 kbit 8 2KX8 5 V 55 ns STANDARD SRAM AUTOMATIC POWER-DOWN COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 4.5 V 120 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Not Qualified 125 °C -55 °C MIL-STD-883 24 CERAMIC, GLASS-SEALED DIP DIP24,.6 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.715 mm 31.877 mm 15.24 mm PYRAMID SEMICONDUCTOR CORP CERAMIC, DIP-24 compliant DIP 24 3A001.A.2.C 8542.32.00.41
8403611JA
Teledyne e2v
Check for Price Obsolete 16.384 kbit 8 2KX8 5 V 55 ns STANDARD SRAM AUTOMATIC POWER-DOWN COMMON 1 2000 2.048 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 4.5 V 120 µA 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Not Qualified 125 °C -55 °C 38535Q/M;38534H;883B 24 CERAMIC, GLASS-SEALED DIP DIP24,.6 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.715 mm 31.877 mm 15.24 mm TELEDYNE E2V (UK) LTD CERAMIC, DIP-24 compliant DIP 24 3A001.A.2.C 8542.32.00.41
8403611JA
QP Semiconductor
Check for Price Transferred 16.384 kbit 8 2KX8 5 V 55 ns STANDARD SRAM AUTOMATIC POWER-DOWN 1 2000 2.048 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS MILITARY R-GDIP-T24 Not Qualified 125 °C -55 °C 24 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.715 mm 31.877 mm 15.24 mm QP SEMICONDUCTOR INC CERAMIC, DIP-24 unknown DIP 24 3A001.A.2.C 8542.32.00.41