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M1A3PE1500-1FGG676
Microchip Technology Inc
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$292.6032 | Yes | Active | 1.5 V | 444 | 444 | 38400 | 1500000 | 38400 | FIELD PROGRAMMABLE GATE ARRAY | COMMERCIAL | SQUARE | CMOS | 38400 CLBS, 1500000 GATES | 350 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 70 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | TRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROCHIP TECHNOLOGY INC | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | compliant | 8542.39.00.01 | |||
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A3PE1500-1FGG676
Microchip Technology Inc
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$292.6032 | Yes | Active | 1.5 V | 1500000 | 38400 | FIELD PROGRAMMABLE GATE ARRAY | COMMERCIAL | SQUARE | CMOS | 38400 CLBS, 1500000 GATES | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 70 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | TRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROCHIP TECHNOLOGY INC | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | compliant | 8542.39.00.01 | |||||||
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A3PE1500-1FGG676I
Microchip Technology Inc
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$336.4919 | Yes | Active | 1.5 V | 1500000 | 38400 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 38400 CLBS, 1500000 GATES | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | TRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROCHIP TECHNOLOGY INC | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | compliant | 8542.39.00.01 | ||||||
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M1A3PE1500-1FGG676I
Microchip Technology Inc
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$336.4919 | Yes | Active | 1.5 V | 444 | 444 | 38400 | 1500000 | 38400 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 38400 CLBS, 1500000 GATES | 350 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | TRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROCHIP TECHNOLOGY INC | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | compliant | 8542.39.00.01 | ||
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M7A3PE1500-1FGG676
Microsemi Corporation
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Check for Price | Yes | Obsolete | 1.5 V | 444 | 444 | 38400 | 1500000 | FIELD PROGRAMMABLE GATE ARRAY | COMMERCIAL | SQUARE | CMOS | 38400 CLBS, 1500000 GATES | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 70 °C | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | MICROSEMI CORP | BGA, BGA676,26X26,40 | compliant | 8542.39.00.01 | ||||||||
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A3PE1500-1FGG676YI
Microsemi Corporation
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Check for Price | Yes | Transferred | 444 | 444 | 38400 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 350 MHz | S-PBGA-B676 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | MICROSEMI CORP | BGA, BGA676,26X26,40 | compliant | 8542.39.00.01 | ||||||||||||
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A3PE1500-1FGG676
Actel Corporation
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Check for Price | Yes | Transferred | 1.5 V | 444 | 444 | 38400 | 1500000 | 38400 | FIELD PROGRAMMABLE GATE ARRAY | COMMERCIAL | SQUARE | CMOS | 38400 CLBS, 1500000 GATES | 350 MHz | 1.575 V | 1.425 V | S-PBGA-B676 | Not Qualified | e1 | 3 | 70 °C | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | ACTEL CORP | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | compliant | |||||||
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M1A3PE1500-1FGG676YC
Microsemi FPGA & SoC
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Check for Price | Active | FIELD PROGRAMMABLE GATE ARRAY | MICROSEMI SOC PRODUCTS GROUP | , | unknown | ||||||||||||||||||||||||||||||||||||||||
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M1A3PE1500-1FGG676YI
Microsemi Corporation
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Check for Price | Yes | Transferred | 444 | 444 | 38400 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 350 MHz | S-PBGA-B676 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | MICROSEMI CORP | BGA, BGA676,26X26,40 | compliant | 8542.39.00.01 | ||||||||||||
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M1A3PE1500-1FGG676YI
Microsemi FPGA & SoC
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Check for Price | Transferred | 444 | 444 | 38400 | FIELD PROGRAMMABLE GATE ARRAY | INDUSTRIAL | SQUARE | CMOS | 350 MHz | S-PBGA-B676 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 250 | 30 | 676 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | MICROSEMI SOC PRODUCTS GROUP | BGA, BGA676,26X26,40 | unknown | 8542.39.00.01 |