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AM29LV200BB-70EK
Spansion
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Check for Price | Yes | Obsolete | 2.0972 Mbit | 16 | 128KX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | MILITARY | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 125 °C | -55 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SPANSION INC | TSOP1 | LEAD FREE, MO-142DD, TSOP1-48 | 48 | compliant | 3A001.A.2.C | 8542.32.00.51 | |||||||||||||||
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AM29LV200BB-80EE
Spansion
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Check for Price | No | No | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 3 V | 80 ns | FLASH | 16 | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | MILITARY | NOR TYPE | R-PDSO-G48 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 48 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | SPANSION INC | TSOP | TSOP-48 | 48 | compliant | 3A001.A.2.C | 8542.32.00.51 | ||||||||||||||||
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AM29LV200BB-60RDPI
AMD
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Check for Price | Transferred | 2.0972 Mbit | 16 | 128KX16 | 3.3 V | 60 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-XUUC-N43 | Not Qualified | 85 °C | -40 °C | 43 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | ADVANCED MICRO DEVICES INC | DIE | DIE-43 | 43 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
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AM29LV200BB-50RSC
AMD
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Check for Price | Transferred | 2.0972 Mbit | 8 | 256KX8 | 3 V | 50 ns | FLASH | MIN 1000K WRITE CYCLES; CAN BE CONFG AS 128K X 16; BOTTOM BOOT BLOCK | BOTTOM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | COMMERCIAL | NOR TYPE | R-PDSO-G44 | Not Qualified | 70 °C | 44 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.8 mm | 28.2 mm | 13.3 mm | ADVANCED MICRO DEVICES INC | SOIC | SOP-44 | 44 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||
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AM29LV200BB-120WAD
Spansion
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Check for Price | Yes | Obsolete | 2.0972 Mbit | 16 | 128KX16 | 3 V | 120 ns | FLASH | BOTTOM BOOT BLOCK | 8 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | COMMERCIAL | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | TFBGA, | 48 | compliant | ||||||||||||||||||
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AM29LV200BB-55RWAI
Spansion
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Check for Price | No | Obsolete | 2.0972 Mbit | 16 | 128KX16 | 3.3 V | 55 ns | FLASH | BOTTOM BOOT BLOCK | 8 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 240 | 30 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | TFBGA, | 48 | compliant | |||||||||||||||||
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AM29LV200BB-90WAI
AMD
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Check for Price | No | Transferred | 2.0972 Mbit | 16 | 16K,8K,32K,64K | 128KX16 | 3 V | 90 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,3 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | ADVANCED MICRO DEVICES INC | BGA | 6 X 8 MM, 0.80 MM PITCH, FBGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||||||
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AM29LV200BB-120DPI
AMD
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Check for Price | Transferred | 2.0972 Mbit | 16 | 128KX16 | 3 V | 120 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-XUUC-N43 | Not Qualified | 85 °C | -40 °C | 43 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | ADVANCED MICRO DEVICES INC | DIE | DIE-43 | 43 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||||||||
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AM29LV200BB-120WAF
Spansion
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Check for Price | Yes | Obsolete | 2.0972 Mbit | 16 | 128KX16 | 3 V | 120 ns | FLASH | BOTTOM BOOT BLOCK | 8 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | TFBGA, | 48 | compliant | |||||||||||||||||
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AM29LV200BB-90WAE
Spansion
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Check for Price | No | Obsolete | 2.0972 Mbit | 16 | 128KX16 | 3 V | 90 ns | FLASH | BOTTOM BOOT BLOCK | 8 | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | MILITARY | R-PBGA-B48 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 240 | 30 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | TFBGA, | 48 | compliant |