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AM29SL400CB-120WAI
AMD
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Check for Price | Transferred | 4.1943 Mbit | 16 | 256KX16 | 1.8 V | 120 ns | FLASH | 8 | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 1.8 V | 2.2 V | 1.65 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | ADVANCED MICRO DEVICES INC | BGA | TFBGA, | 48 | unknown | ||||||||||||||||||||||
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AM29SL400CB120WAI
AMD
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Check for Price | No | Transferred | 4.1943 Mbit | 16 | 16K,8K,32K,64K | 256KX16 | 1.8 V | 120 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,7 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 5 µA | 25 µA | 2.2 V | 1.65 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | ADVANCED MICRO DEVICES INC | BGA | 6 X 8 MM, 0.80 MM PITCH, FBGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||||
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AM29SL400CB-120WAI
Spansion
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Check for Price | No | Obsolete | 4.1943 Mbit | 16 | 256KX16 | 1.8 V | 120 ns | FLASH | 8 | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 1.8 V | 2.2 V | 1.65 V | CMOS | INDUSTRIAL | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 240 | 30 | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | TFBGA, | 48 | compliant | ||||||||||||||||
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AM29SL400CB120WAI
Spansion
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Check for Price | No | Obsolete | 4.1943 Mbit | 16 | 16K,8K,32K,64K | 256KX16 | 1.8 V | 120 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,7 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 5 µA | 25 µA | 2.2 V | 1.65 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | 6 X 8 MM, 0.80 MM PITCH, FBGA-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 |