Parametric results for: CBT3257ABQ under Multiplexer/Demultiplexers

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Manufacturer Part Number: cbt3257abq
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CBT3257ABQ
NXP Semiconductors
Check for Price Yes Yes Transferred 5 V 250 ps 4 1 2 YES HVQCCN 3-STATE 3257 MULTIPLEXER AND DEMUX/DECODER TRUE 5.5 V 4.5 V INDUSTRIAL R-PQCC-N16 Not Qualified e4 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 1 mm 2.5 mm 3.5 mm NXP SEMICONDUCTORS QFN 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, VQFN-16 16 compliant 8542.39.00.01
CBT3257ABQ,115
NXP Semiconductors
Check for Price Yes Transferred 5 V 250 ps 4 1 2 YES HVQCCN 3-STATE 3257 MULTIPLEXER AND DEMUX/DECODER TRUE 5.5 V 4.5 V INDUSTRIAL R-PQCC-N16 Not Qualified e4 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY LCC16,.1X.14,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm QUAD 1 mm 2.5 mm 3.5 mm NXP SEMICONDUCTORS QFN HVQCCN, LCC16,.1X.14,20 16 compliant 8542.39.00.01 SOT763-1
CBT3257ABQ,115
Nexperia
Check for Price Active 5 V 250 ps 4 1 2 YES HVQCCN 3-STATE 3257 MULTIPLEXER AND DEMUX/DECODER TRUE 5.5 V 4.5 V INDUSTRIAL R-PQCC-N16 Not Qualified e4 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TR, 7 INCH NICKEL PALLADIUM GOLD SILVER NO LEAD 500 µm QUAD 1 mm 2.5 mm 3.5 mm NEXPERIA QFN HVQCCN, 16 compliant 8542.39.00.01 SOT763-1 Nexperia
CBT3257ABQ
Nexperia
Check for Price Yes Active 5 V 250 ps 250 ps 4 2 YES HVQCCN 50 pF BIDIRECTIONAL 3-STATE CBT/FST/QS/5C/B BUS EXCHANGER CMOS ENABLE LOW 3 TRUE 3 µA 5.5 V 4.5 V INDUSTRIAL R-PQCC-N16 e4 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY LCC16,.1X.14,20 RECTANGULAR CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE NICKEL PALLADIUM GOLD SILVER NO LEAD 500 µm QUAD 1 mm 2.5 mm 3.5 mm NEXPERIA VQCCN, compliant 8542.39.00.01 2017-02-01