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GT28F008B3B90
Intel Corporation
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Check for Price | No | Obsolete | 8.3886 Mbit | 8 | 8K,64K | 1MX8 | 3 V | 90 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | NO | 100000 Write/Erase Cycles | 1 | 8,15 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 5 µA | 55 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | BGA45,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 750 µm | BOTTOM | 1 mm | INTEL CORP | BGA | CSP, MICRO, BGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||
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GT28F008B3B110
Intel Corporation
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Check for Price | No | Obsolete | 8.3886 Mbit | 8 | 8K,64K | 1MX8 | 3 V | 110 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | NO | 100000 Write/Erase Cycles | 1 | 8,15 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 5 µA | 55 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | BGA45,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 750 µm | BOTTOM | 1 mm | INTEL CORP | BGA | CSP, MICRO, BGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||
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GT28F008B3B110
Rochester Electronics LLC
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 3 V | 110 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 750 µm | BOTTOM | 1 mm | ROCHESTER ELECTRONICS LLC | BGA | CSP, MICRO, BGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | |||||||||||
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GT28F008B3B90
Rochester Electronics LLC
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Check for Price | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 3 V | 90 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B48 | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 750 µm | BOTTOM | 1 mm | ROCHESTER ELECTRONICS LLC | VFBGA, | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||
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GT28F008B3B120
Rochester Electronics LLC
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Check for Price | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 120 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B48 | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 750 µm | BOTTOM | 1 mm | ROCHESTER ELECTRONICS LLC | VFBGA, | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||||
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GT28F008B3B150
Intel Corporation
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Check for Price | No | Obsolete | 8.3886 Mbit | 8 | 8K,64K | 1MX8 | 150 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | NO | 10000 Write/Erase Cycles | 1 | 8,15 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 10 µA | 23 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | BGA45,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 750 µm | BOTTOM | 1 mm | INTEL CORP | BGA | CSP, MICRO, BGA-48 | 48 | unknown | EAR99 | 8542.32.00.51 | ||||
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GT28F008B3B120
Intel Corporation
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Check for Price | No | Obsolete | 8.3886 Mbit | 8 | 8K,64K | 1MX8 | 120 ns | FLASH | BOTTOM BOOT BLOCK | BOTTOM | YES | NO | 10000 Write/Erase Cycles | 1 | 8,15 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 10 µA | 23 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NO | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | VFBGA | BGA45,6X8,30 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 750 µm | BOTTOM | 1 mm | INTEL CORP | BGA | VFBGA, BGA45,6X8,30 | 48 | unknown | EAR99 | 8542.32.00.51 |