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HYB18L256160BF-7.5
Infineon Technologies AG
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Check for Price | Yes | Transferred | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | 5.4 ns | 133 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 350 µA | 90 µA | 1.95 V | 1.65 V | CMOS | COMMERCIAL | R-PBGA-B54 | Not Qualified | e1 | 70 °C | 54 | PLASTIC/EPOXY | FBGA | BGA54,9X9,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 12 mm | 8 mm | INFINEON TECHNOLOGIES AG | BGA | 12 X 8 MM, 1 MM HEIGHT, GREEN, PLASTIC, VFBGA-54 | 54 | compliant | EAR99 | 8542.32.00.24 | ||||
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HYB18L256160BF-7.5
Qimonda AG
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | 5.4 ns | 133 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 350 µA | 90 µA | 1.95 V | 1.65 V | CMOS | COMMERCIAL | R-PBGA-B54 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 54 | PLASTIC/EPOXY | FBGA | BGA54,9X9,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 12 mm | 8 mm | QIMONDA AG | BGA | 12 X 8 MM, 1 MM HEIGHT, GREEN, PLASTIC, VFBGA-54 | 54 | unknown | EAR99 | 8542.32.00.24 |