Findchips: Parametric Search Results for IDT71256L150P

Parametric results for: IDT71256L150P under SRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		IDT71256L150TDB Integrated Device Technology Inc
		IDT71256L150L32B Integrated Device Technology Inc
		IDT71256L150L28B8 Integrated Device Technology Inc
		IDT71256L150EB Integrated Device Technology Inc
		IDT71256L150LB Integrated Device Technology Inc
		IDT71256L150L32B8 Integrated Device Technology Inc
		IDT71256L150DB Integrated Device Technology Inc
		IDT71256L150L32BG8 Integrated Device Technology Inc
		IDT71256L150TCB Integrated Device Technology Inc
		IDT71256L150L28B Integrated Device Technology Inc

				Most Relevant					Technical																	Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, CERDIP-28

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N28

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

8.89 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

QCCN,

compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDFP-F28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DFP

FL28,.5

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

FLAT

1.27 mm

DUAL

2.921 mm

18.288 mm

12.446 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

CERPACK-28

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

QCCN,

compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.600 INCH, CERDIP-28

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Yes

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

MATTE TIN

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

35.56 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28

not_compliant

3A001.A.2.C

8542.32.00.41

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC28,.35X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

8.89 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

LCC-28

not_compliant

3A001.A.2.C

8542.32.00.41

1 2 Next

Compare

IDT71256L150TDB

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, CERDIP-28

not_compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150L32B

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

not_compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150L28B8

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N28

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

8.89 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

QCCN,

compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150EB

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDFP-F28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DFP

FL28,.5

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

FLAT

1.27 mm

DUAL

2.921 mm

18.288 mm

12.446 mm

INTEGRATED DEVICE TECHNOLOGY INC

DFP

CERPACK-28

not_compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150LB

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

not_compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150L32B8

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

QCCN,

compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150DB

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.211 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.600 INCH, CERDIP-28

not_compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150L32BG8

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

MATTE TIN

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

11.43 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFJ

LCC-32

compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150TCB

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

35.56 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28

not_compliant

3A001.A.2.C

8542.32.00.41

IDT71256L150L28B

Integrated Device Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

STANDARD SRAM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

200 µA

2 V

125 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC28,.35X.55

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.048 mm

13.97 mm

8.89 mm

INTEGRATED DEVICE TECHNOLOGY INC

QLCC

LCC-28

not_compliant

3A001.A.2.C

8542.32.00.41

1 2 Next