Parametric results for: IDT71V6S75BQI under SRAMs

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Manufacturer Part Number: idt71v6
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IDT71V65902S85BGGI
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65603ZS100BGGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 5 ns ZBT SRAM BURST COUNTER 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65803Z133PFG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 3.8 ns ZBT SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65813S200BG8
Integrated Device Technology Inc
Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 3.2 ns ZBT SRAM 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S75PFGI
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 7.5 ns ZBT SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V67802S150PFGI
Integrated Device Technology Inc
Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 3.8 ns 150 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 1 512000 524.288 k SYNCHRONOUS 3-STATE YES PARALLEL 70 mA 3.135 V 325 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V656S133PF
Integrated Device Technology Inc
Check for Price No No Transferred 9.4372 Mbit 36 256KX36 3.3 V 4.2 ns ZBT SRAM 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn/Pb) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, PLASTIC, TQFP-100 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65603S100BGG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 5 ns ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 compliant 3A991.B.2.A 8542.32.00.41
IDT71V65902S85BQI
Integrated Device Technology Inc
Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 90 MHz ZBT SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 3.14 V 245 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, FPBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V67902S75PF8
Integrated Device Technology Inc
Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 7.5 ns 117 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 265 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41