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MAX1122EGK+D
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68 | 68 | compliant | 3A991.C.1 | 8542.39.00.01 | ||
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MAX1122EGK-D
Maxim Integrated Products
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Check for Price | No | Obsolete | 1.8 V | 1.375 V | 1 | 0.1465 % | 10 | 170 MHz | YES | ADC, PROPRIETARY METHOD | 1.1 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N68 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 68 | UNSPECIFIED | HVQCCN | LCC68,.4SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 10 mm | 900 µm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 | 68 | not_compliant | 8542.39.00.01 |