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Parametric » Power Circuits » Power Management Circuits

Parametric results for: MAX17260SEWL+T under Power Management Circuits

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Select Parts		Part Number

		MAX17260SEWL+T Maxim Integrated Products
		MAX17260SEWL+T Analog Devices Inc

			Most Relevant						Technical		Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Supply Current-Max (Isup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Part Package Code	Pin Count	Manufacturer Package Code	Samacsys Manufacturer

Yes

Transferred

2.3 V

4.9 V

30 µA

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

R-XBGA-B9

e2

1

85 °C

-40 °C

260

30

9

UNSPECIFIED

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.448 mm

1.468 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

WLP-9

compliant

EAR99

8542.39.00.01

2018-08-17

Check for Price

Yes

Active

2.3 V

4.9 V

30 µA

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

R-XBGA-B9

e2

1

85 °C

-40 °C

260

30

9

UNSPECIFIED

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.448 mm

1.468 mm

690 µm

ANALOG DEVICES INC

WLP-9

compliant

2018-06-21

9-WLCSP-N/A

9

9-WLCSP-N/A

Analog Devices

Compare

Maxim Integrated Products

Yes

Transferred

2.3 V

4.9 V

30 µA

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

R-XBGA-B9

e2

1

85 °C

-40 °C

260

30

9

UNSPECIFIED

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

1.448 mm

1.468 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

WLP-9

compliant

EAR99

8542.39.00.01

2018-08-17

Analog Devices Inc

Check for Price

Yes

Active

2.3 V

4.9 V

30 µA

1

YES

NO

POWER SUPPLY SUPPORT CIRCUIT

1

R-XBGA-B9

e2

1

85 °C

-40 °C

260

30

9

UNSPECIFIED

VFBGA

BGA9,3X3,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

1.448 mm

1.468 mm

690 µm

ANALOG DEVICES INC

WLP-9

compliant

2018-06-21

9-WLCSP-N/A

9

9-WLCSP-N/A

Analog Devices