Parametric results for: MC33907AE under Network Interfaces
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MC33907AER2
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PQFP-G48 | e3 | 3 | 125 °C | -40 °C | 48 | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | FREESCALE SEMICONDUCTOR INC | HLFQFP, | compliant | EAR99 | 8542.39.00.01 | NXP | ||||
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MC33907AER2
NXP Semiconductors
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Check for Price | Yes | Obsolete | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PQFP-G48 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | NXP SEMICONDUCTORS | LQFP-48 | compliant | EAR99 | 8542.39.00.01 | NXP | ||||||
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MC33907AE
NXP Semiconductors
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Check for Price | Yes | Obsolete | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PQFP-G48 | 125 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | NXP SEMICONDUCTORS | LQFP-48 | compliant | EAR99 | 8542.39.00.01 | NXP | ||||||
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MC33907AE
Freescale Semiconductor
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Check for Price | Yes | Yes | Transferred | INTERFACE CIRCUIT | 1 | AUTOMOTIVE | S-PQFP-G48 | e3 | 3 | 125 °C | -40 °C | 48 | PLASTIC/EPOXY | HLFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.6 mm | FREESCALE SEMICONDUCTOR INC | HLFQFP, | compliant | EAR99 | 8542.39.00.01 | NXP |