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Parametric results for: MCIMX6X3CVO08AB under Microprocessors

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Manufacturer Part Number: mcimx6x3cvo08ab

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Select Parts		Part Number

		MCIMX6X3CVO08AB NXP Semiconductors
		MCIMX6X3CVO08AB Freescale Semiconductor

				Most Relevant	Technical					Compliance		Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Surface Mount	uPs/uCs/Peripheral ICs Type	Technology	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

$30.0250

Yes

Active

YES

SoC

CMOS

1.5 V

1.275 V

INDUSTRIAL

S-PBGA-B400

105 °C

-40 °C

260

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.53 mm

17 mm

NXP SEMICONDUCTORS

BGA-400

compliant

5A992.C

8542.31.00.01

Check for Price

Yes

Transferred

MICROPROCESSOR, RISC

CMOS

TIN SILVER COPPER

FREESCALE SEMICONDUCTOR INC

compliant

Compare

MCIMX6X3CVO08AB

NXP Semiconductors

$30.0250

Yes

Active

YES

SoC

CMOS

1.5 V

1.275 V

INDUSTRIAL

S-PBGA-B400

105 °C

-40 °C

260

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.53 mm

17 mm

NXP SEMICONDUCTORS

BGA-400

compliant

5A992.C

8542.31.00.01

MCIMX6X3CVO08AB

Freescale Semiconductor

Check for Price

Yes

Transferred

MICROPROCESSOR, RISC

CMOS

TIN SILVER COPPER

FREESCALE SEMICONDUCTOR INC

compliant