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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MPC7410THX400LE under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		MPC7410THX400LE NXP Semiconductors
		MPC7410THX400LE Motorola Semiconductor Products
		MPC7410THX400LE Freescale Semiconductor
		MPC7410THX400LE Motorola Mobility LLC

				Most Relevant							Technical									Compliance			Operating Conditions					Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

Check for Price

No

Obsolete

400 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

NO

FIXED POINT

NO

NO

1.9 V

1.7 V

INDUSTRIAL

R-PBGA-B

Not Qualified

e0

1

105 °C

-40 °C

260

40

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

BOTTOM

NXP SEMICONDUCTORS

BGA,

unknown

3A991.A.1

8542.31.00.01

NXP

Check for Price

Transferred

32

400 MHz

64

32

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

Check for Price

No

No

Transferred

32

400 MHz

64

32

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

e0

1

260

40

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

Check for Price

Transferred

32

400 MHz

64

32

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

360

Compare

MPC7410THX400LE

NXP Semiconductors

Check for Price

No

Obsolete

400 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

NO

FIXED POINT

NO

NO

1.9 V

1.7 V

INDUSTRIAL

R-PBGA-B

Not Qualified

e0

1

105 °C

-40 °C

260

40

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

BOTTOM

NXP SEMICONDUCTORS

BGA,

unknown

3A991.A.1

8542.31.00.01

NXP

MPC7410THX400LE

Motorola Semiconductor Products

Check for Price

Transferred

32

400 MHz

64

32

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

Microcontrollers and Processors

MPC7410THX400LE

Freescale Semiconductor

Check for Price

No

No

Transferred

32

400 MHz

64

32

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

e0

1

260

40

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

Microcontrollers and Processors

MPC7410THX400LE

Motorola Mobility LLC

Check for Price

Transferred

32

400 MHz

64

32

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.9 V

1.7 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

360