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S25FL256SAGMFIR01
Spansion
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$2.6488 | Yes | Transferred | 268.4355 Mbit | 4 | 64MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | SOIC | SOIC-16 | 16 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | ||||||||
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S25FL256SAGMFIR01
Cypress Semiconductor
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$4.1772 | Yes | Transferred | 268.4355 Mbit | 4 | 64MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | BOTTOM | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | CYPRESS SEMICONDUCTOR CORP | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||
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S25FL256SAGMFIR01
Infineon Technologies AG
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$4.7200 | Yes | Active | 268.4355 Mbit | 4 | 64MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | e3 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | INFINEON TECHNOLOGIES AG | compliant | Infineon |