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S25FL256SAGNFI001
Spansion
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$2.6765 | Yes | Transferred | 268.4355 Mbit | 4 | 64MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | SPANSION INC | SON | WSON-8 | 8 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | ||||||
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S25FL256SAGNFI001
Infineon Technologies AG
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$5.0369 | Yes | Active | 268.4355 Mbit | 4 | 64MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | INFINEON TECHNOLOGIES AG | 8 | compliant | 3A991.B.1.A | 8542.32.00.51 | Infineon | |||||
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S25FL256SAGNFI001
Cypress Semiconductor
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$5.6136 | Yes | Transferred | 268.4355 Mbit | 4 | 64MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | BOTTOM | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | compliant | 3A991.B.1.A | 8542.32.00.51 |